MEMS

New Nanocomposite Films Boost Heat Dissipation in Thin Electronics

Scientists from Japan developed cellulose nanofiber-carbon fiber composite films with high in-plane heat conductivity to assist in heat dissipation.

Defense Strategies Institute Announces 2022 Assured Microelectronics Summit Agenda

Defense Strategies Institute is pleased to announce the agenda for the 2022 Assured Microelectronics Summit is now available.

Imec Researchers Work to Debut Key Building Block for the Deployment of 100G PON Networks

Presenting world’s first upstream 100 Gbit/s PAM-4 linear burst-mode transimpedance amplifier (TIA) chip for the roll-out of next-generation flexible PONs.

Rockley Photonics Unveils Next-Generation, Higher-Density Laser Spectrophotometer Chip for Wearable Health Monitoring

Groundbreaking achievement in micro-transfer printing increases density of Rockley’s silicon-photonics-based integrated lasers beyond previous levels.

onsemi Expands its Silicon Carbide Fab in the Czech Republic

The facility will increase its Silicon Carbide (SiC) wafer production capacity by 16 times over the next two years to address the sharply increasing demand for microchips.

CEA RF Chip Enables Ultralow-Power IoT Connectivity For Remote Devices Via Astrocast’s Nanosatellite Network

CEA, a technology-research organization, and Astrocast, a global satellite Internet of Things network operator, have announced their successful collaboration on a low-cost, bidirectional communication module that enables corporations to communicate with their remote assets in areas not covered by terrestrial networks.

EV Group and Toppan Photomask Join Forces to Accelerate Market Adoption of Nanoimprint Lithography for Photonics Manufacturing

EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and Toppan Photomask Co. Ltd., a photomask provider, today announced that they have entered into an agreement to jointly market nanoimprint lithography (NIL) as an enabling high-volume manufacturing (HVM) process for the photonics industry.

New Wearable Device Measures the Changing Size of Tumors Below the Skin

Electronically sensitive, skin-like membrane can measure changes in tumor size to the hundredth of a millimeter. It represents a new, faster and more accurate approach to screen cancer drugs.

Reverse-Engineering the Brain to Decode Input Signals from Output Neuron Firing

Scientists from Japan demonstrate the possibility of reconstructing common brain input signals from the firing rates of neurons.

Secretaries of State, Commerce Discuss Efforts to Build a U.S Microelectronics Ecosystem

U.S. Secretary of State Antony J. Blinken and Secretary of Commerce Gina Raimondo visited Purdue University on Tuesday (Sept. 13) to tour university research facilities and meet students as they embark on their mission to bolster the U.S. semiconductor industry.

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