This week, at the 2022 IEEE International Ultrasonics Symposium, imec presents a piezoelectric Micromachined Ultrasound Transducer (pMUT) array that is compatible with flat-panel-displays (FPD) process technologies.
MEMS
CHIPS for America Seeks Public Input on Financial Incentives, New Institutes for Semiconductor Manufacturing
The U.S. Department of Commerce’s National Institute of Standards and Technology (NIST) CHIPS for America initiative is seeking public input on two programs that aim to restore U.S. global leadership in semiconductor manufacturing
Weebit Nano Advances its ReRAM Selector Development to Fit Embedded & Discrete Applications
Weebit Nano Limited, a developer of next-generation memory technologies for the global semiconductor industry, has made significant progress in its selector development with new results confirming its ReRAM selector is suitable for both embedded and discrete (stand-alone) applications, greatly increasing the number of possible applications for Weebit’s technology.
What’s in the October Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the October issue. If you are attending SEMICON Europa stop by the publication bins and pick up a copy in print!
Can Binary or Ternary Compounds Beat Cu in Future Interconnect Applications?
A unique methodology to explore alternative interconnect metals for the Ångström era.
Samsung Electronics Envisions Hyper-Growth in Memory and Logic Semiconductors through Intensified Industry Collaborations at Samsung Tech Day 2022
Samsung Electronics Co., Ltd. today showcased a series of cutting-edge semiconductor solutions set to drive digital transformation through the decade, at Samsung Tech Day 2022.
High-Performance and High-Reliability Artificial Synaptic Semiconductor Device Regarding Next-Generation Brain-Mimicking Computing
KIST discovered critical variables to maximize the performance of artificial synaptic devices. Green light for next-generation neuromorphic system development.
STMicroelectronics to Build Integrated Silicon Carbide Substrate Manufacturing Facility in Italy
STMicroelectronics will build an integrated Silicon Carbide (SiC) substrate manufacturing facility in Italy to support the increasing demand from ST’s customers for SiC devices across automotive and industrial applications as they transition to electrification and seek higher efficiency.
Mark Templeton Inducted into Phil Kaufman Hall of Fame by the ESD Alliance and IEEE CEDA
Mark Templeton, the former managing director of investment firm Scientific Ventures, and a Lanza techVentures investment partner and board member, today was inducted posthumously into the Phil Kaufman Hall of Fame.
Industry Well Represented on New U.S. Government Advisory Committee on Microelectronics Industry
Two of the electronics industry’s most far-sighted and innovative leaders have been named to the U.S. Department of Commerce’s new Industrial Advisory Committee (IAC), which will provide guidance to the Secretary of Commerce on a range of issues related to CHIPS for America Act programs.
