Omnitron Sensors has secured $13M+ in Series A funding led by Corriente Advisors, LLC, with participation from longtime investor L’ATTITUDE Ventures.
MEMS
SIA Applauds House Introduction of Legislation to Strengthen American Chip Manufacturing and Design
The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer commending the introduction in the U.S. House of Representatives of the bipartisan Semiconductor Technology Advancement and Research (STAR) Act.
Sunny Stalnaker of ASML to Receive SEMI Sales and Marketing Excellence Award
SEMI today announced that Sunny Stalnaker of ASML has won the 2025 SEMI Sales and Marketing Excellence Award, inspired by Bob Graham.
Foundries in Europe 2024
Europe will be ready to grow again its market share but should maintain the current status quo and still source about 50% of production abroad.
Singular Photonics Emerges from Stealth with Portfolio of SPAD-based Image Sensors
Singular Photonics emerged from stealth mode today, launching a new generation of image sensors based on single photon avalanche diodes (SPADs).
New Optical Memory Unit Poised to Improve Processing Speed and Efficiency
Fast, versatile volatile photonic memory could enhance AI, sensing and other computationally intense applications.
MACOM Signs Preliminary Memorandum of Terms for Federal CHIPS and Science Act Funding
Today, the Healey-Driscoll administration celebrated MACOM Technology Solutions Inc. (MACOM), the Lowell-based manufacturer that develops and supplies semiconductor components to the commercial and defense sectors, signing a preliminary memorandum of terms with the federal government for funding under the CHIPS for America program.
GF Piping Systems and Gradiant Partner Up to Drive Innovation for Sustainable Water Treatment
The collaboration aims to address the growing demands of the microelectronics and water industry, where precision, sustainability, and innovation are critical to success.
Alchip Opens 3DIC ASIC Design Services
Alchip Technologies, Limited, the high-performance ASIC leader, has formally opened its three-dimensional integrated circuit (3DIC) design services for the latest high-performance ASICs targeting AI and high-performance computing (HPC) applications.
SiTime Precision Timing Enables New Architectures for More Efficient AI Datacenters
SiTime Corporation, the precision timing company, today announced the differential-ended SiT5977 Super-TCXO, the newest member of the SiTime Elite RF family.
