On-skin medical sensors and wearable health devices are important health care tools that must be incredibly flexible and ultrathin so they can move with the human body.
MEMS
Nearly $11M in Addtional DOD Funds Expands Purdue-led Microelectronics Workforce Program
Five-year extension of SCALE workforce initiative aims to restore global lead through education initiatives.
Synopsys Advances Silicon Lifecycle Management to Accelerate Data Transport and Significantly Reduce Test Time
Enabling real-time analytics for silicon health monitoring of increasingly large, complex designs, Synopsys, Inc. today announced an innovative streaming fabric technology that shortens both silicon data access and test time by up to 80% while also minimizing excessive power.
Global Fab Equipment Spending Forecast to Reach All-Time High of Nearly $100 Billion in 2022
Global fab equipment spending for front-end facilities is expected to increase approximately 9% year-over-year (YOY) to a new all-time high of US$99 billion in 2022.
New Nanocomposite Films Boost Heat Dissipation in Thin Electronics
Scientists from Japan developed cellulose nanofiber-carbon fiber composite films with high in-plane heat conductivity to assist in heat dissipation.
Defense Strategies Institute Announces 2022 Assured Microelectronics Summit Agenda
Defense Strategies Institute is pleased to announce the agenda for the 2022 Assured Microelectronics Summit is now available.
Imec Researchers Work to Debut Key Building Block for the Deployment of 100G PON Networks
Presenting world’s first upstream 100 Gbit/s PAM-4 linear burst-mode transimpedance amplifier (TIA) chip for the roll-out of next-generation flexible PONs.
Rockley Photonics Unveils Next-Generation, Higher-Density Laser Spectrophotometer Chip for Wearable Health Monitoring
Groundbreaking achievement in micro-transfer printing increases density of Rockley’s silicon-photonics-based integrated lasers beyond previous levels.
onsemi Expands its Silicon Carbide Fab in the Czech Republic
The facility will increase its Silicon Carbide (SiC) wafer production capacity by 16 times over the next two years to address the sharply increasing demand for microchips.
CEA RF Chip Enables Ultralow-Power IoT Connectivity For Remote Devices Via Astrocast’s Nanosatellite Network
CEA, a technology-research organization, and Astrocast, a global satellite Internet of Things network operator, have announced their successful collaboration on a low-cost, bidirectional communication module that enables corporations to communicate with their remote assets in areas not covered by terrestrial networks.
