Rambus Inc. today announced the expansion of its DDR5 memory interface chip portfolio with the addition of the Rambus SPD (Serial Presence Detect) Hub and Temperature Sensor.
MEMS
Silicon Carbide Cooperation Between SEMIKRON and ROHM Semiconductor
ROHM’s SiC technology empowers SEMIKRON’s eMPack for the next generation of electric vehicles.
Equipment Efficiency, Materials Costs Challenge Flash Makers
Flash industry needs better capital productivity for virtuous cycle to continue.
New SEMI Auto IC Master Guide to Help Drive Closer Collaboration Between Taiwan Chip Providers and Automotive Ecosystem
SEMI Taiwan launched the SEMI Auto IC Master, a comprehensive guide to automotive semiconductor and component providers in Taiwan.
The Science of Change and Preparing for the Next Unknown
In the last two years, the COVID-19 crisis has shined a light on the growing sense of uncertainty felt across the globe. According to Dr. Vanessa Akhtar of Kotter, this is not an anomaly—according to their research, uncertainty has been the trend for the last few decades.
Advanced Energy Expands High Accuracy Temperature Monitoring Portfolio
New sensing platform with RubiLux and VioLux phosphor formulations enable precise, repeatable measurement across an extended temperature range.
SEMI Standards’ Leaders Honored at SEMICON West 2022
SEMI, the global industry association that unites the entire electronics manufacturing and design supply chain, announced it honored industry leaders for their outstanding accomplishments in developing Standards for the electronics and related industries.
20 Year Roadmap: Tearing Down the Walls
On Monday, in advance of SEMICON West, imec hosted its annual International Technology Forum (ITF).
Shortage to Surplus Cycle Hits Semi But One Segment Escapes
One major part of the semiconductor industry is escaping the downward trend felt by the larger market. But this time, it’s different.
EV Group Achieves Die-to-Wafer Fusion and Hybrid Bonding Milestone with 100% Die Transfer Yield on Multi-Die 3D SoC
EV Group (EVG) today announced it has achieved a major breakthrough in die-to-wafer (D2W) fusion and hybrid bonding by successfully demonstrating 100-percent void-free bonding yield of multiple die of different sizes from a complete 3D system-on-a-chip (SoC) in a single transfer process using EVG’s GEMINI FB automated hybrid bonding system.
