The move to 300mm wafers as a substantial leap forward for the MEMS industry in manufacturing automation and cost-effectiveness, yet many challenges remain.
MEMS
2025: Photonic Integrated Circuits – Driving Quantum Technology
Innovations around photonic integrated circuits (PICs) have the potential to transform our ability to meet the demands of our increasingly data-driven world.
2025: Opportunities Abound for Semiconductor Equipment
As we look ahead to 2025, we’re seeing three major trends: a growing compound semiconductor market, the resurgence of wet bench technology and growing workforce development needs.
CreeLED Inc. Files Patent Infringement Lawsuit Against ADJ Products, LLC
Cree LED, a Penguin Solutions brand, today announced that it has filed a patent infringement lawsuit in the United States District Court for the Northern District of California against ADJ Products, LLC (ADJ).
SonicEdge Unveils World’s First MEMS Speaker-Microphone Solution for TWS Devices
SonicEdge LTD announced the launch of SonicTwin at CES 2025.
Advancing Light Control: New Opportunities for Metasurfaces in Optoelectronics
A global review of advancements in integrating metasurfaces – thin planar arrays of nanostructures – into optoelectronic devices highlights their potential to transform technologies such as Light Emitting Diodes (LEDs), lasers, optical modulators, and photodetectors.
What’s in the November/December Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the November/December issue.
Frontgrade Gaisler Leads European Initiative for Ultra Deep Sub-Micron Semiconductor Technology for Space Applications
Under a newly signed contract with the European Space Agency (ESA), Frontgrade Gaisler is leading an ambitious initiative to secure European sovereignty in advanced semiconductor technologies for space applications.
Working Group Named Targeting Billions in CHIPS and Science Act Funding for Washington State
Commerce Department announces first working group members to develop statewide response to historic federal funding opportunities, slates first meeting Dec. 17.
ROHM’s PMICs for SoCs Adopted in Reference Designs for Telechips’ Next-Generation Cockpits
Intended for use inside the cockpits of European automakers, these designs are scheduled for mass production in 2025.
