MEMS

Secure-IC Raises €20M to Accelerate the Development of Its Cybersecurity Solutions for Connected Objects

After 10 years of sustained and controlled growth on equity, Secure-IC, a provider of end-to-end cybersecurity solutions for embedded systems and connected objects announced today a first capital raising of 20 million euros.

U.S. Is Keystone of the World’s Science and Engineering Ecosystem

In ecological science, a keystone species is essential to the entire ecosystem. Weaken or remove a keystone and it impacts everything else. The National Science Board’s The State of U.S. Science and Engineering 2022 published today, shows that for the world’s science and engineering (S&E) ecosystem, the U.S. is such a keystone.

Advanced Energy’s 2022 Scholarship Program Strives to Promote Diversity in STEM

Advanced Energy today announced the launch of this year’s Advanced Energy STEM Diversity Scholarship Program.

2022 Semiconductor Materials Outlook: COVID-19 Pandemic Still Having Lasting Effects on All Materials

The COVID-19 pandemic has created strong demand for both logic and memory ICs to support continued Work from Home and School from Home, and as such demand is expected to increase despite expanding availability of virus vaccines.

Valens Semiconductor First-in-Industry to Ship Engineering Samples of MIPI A-PHY Standard Chipsets to Leading Automotive OEMs and Tier 1s

The Valens VA7000 chipset family is the first on the market to implement the MIPI A-PHY standard for in-vehicle sensor connectivity.

New IDC Spending Guide Forecasts Double-Digit Growth for Investments in Edge Computing

Worldwide spending on edge computing is expected to be $176 billion in 2022, an increase of 14.8% over 2021.

DuPont To Launch Pyralux HP Laminate Adhesive System for High-Performance Electronics

DuPont Interconnect Solutions (ICS), a business within the Electronics & Industrial segment, will introduce the Pyralux HP laminate adhesive system at the 2022 Institute for Printed Circuits (IPC) APEX Exposition to be held in San Diego, CA from January 25 – 27, 2022.

Toshiba Opens the Way to Longer Life Wearables and IoT Devices With New IC Chips

Minute, ultra-low quiescent current load switch ICs yield huge performance improvements.

Gelest Inc. Names Dr. Jonathan Goff as President

Gelest Inc. names Dr. Jonathan Goff as President of Gelest effective immediately.

Advancing the Future of Semiconductor Manufacturing

Manufacturing innovation can be achieved through greater capacity utilization, component reliability, and process control.

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