eInfochips, an Arrow Electronics company, announced the company has joined the Samsung Advanced Foundry Ecosystem (SAFE) as a Virtual Design Partner.
Packaging
sureCore PowerMiser IP Enables KU Leuven Chip for AI Applications to Achieve Dynamic Power Saving of Greater Than 40%
SureCore, the ultra-low power memory specialist, has enabled KU Leuven, Belgium’s renowned research university, to develop a neural processing accelerator chip for AI applications that boasts dynamic power savings in excess of 40%, compared to solutions using the industry standard SRAM.
Launch of a Large Glass Substrate Inspection System for Advanced Semiconductor Packaging
TASMIT Inc. has developed a new inspection system for glass substrates as part of its INSPECTRA series of semiconductor wafer visual inspection systems, which has gained attention for its high efficiency in advanced semiconductor manufacturing.
Baya Systems and Semidynamics Collaborate to Accelerate RISC-V System-on-Chip Development
Baya Systems and Semidynamics today announced a collaboration to boost innovation in development of hyper-efficient, next-generation platforms for artificial intelligence (AI), machine learning (ML) and high-performance computing (HPC) applications.
Micron Announces Shipment of 1γ (1-gamma) DRAM
Micron delivers superior performance and power efficiency to data center, client and mobile platforms with the industry’s first high performance 1γ node.
SEMICON Southeast Asia 2025 Celebrates 30 Years of Innovation Through Collaboration
SEMICON Southeast Asia will take place from 20-22 May at the Sands Expo and Convention Centre in Singapore.
Pfeiffer Vacuum+Fab Solutions Achieves Validation of Emission Reduction Targets
Pfeiffer Vacuum+Fab Solutions, a member of the global Busch Group, announces that its science-based targets for reducing carbon emissions have now been officially approved by the Science Based Targets initiative (SBTi).
Karsten Einwich to Receive Accellera Systems Initiative Technical Excellence Award
Accellera Systems Initiative (Accellera) announced today that Karsten Einwich, a member of the SystemC AMS Working Group, is the recipient of the 2025 Accellera Technical Excellence Award.
Pfeiffer Vacuum+Fab Solutions Presents the New HiScroll 46
Pfeiffer Vacuum+Fab Solutions – a member of the global Busch Group – announces the launch of the HiScroll 46, the newest member of its HiScroll series.
Lam Research Unveils Industry’s Most Advanced Conductor Etch Technology to Date
Lam Research Corp. today introduced Akara, a breakthrough innovation in plasma etch and the most advanced conductor etch tool available.
