Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded SK hynix up to $458 million in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.
Packaging
Micromax and Phison Partner to Launch MiPhi, Powering India’s Next-Generation of NAND Storage Technology
The joint venture will enable MiPhi to develop high-end and customized NAND storage products for enterprise, consumer, embedded, AI, and security applications for India and specific agreed-upon regions.
CreeLED Inc. Files Patent Infringement Lawsuit Against ADJ Products, LLC
Cree LED, a Penguin Solutions brand, today announced that it has filed a patent infringement lawsuit in the United States District Court for the Northern District of California against ADJ Products, LLC (ADJ).
Why Chiplet-Based Architecture Is the Next Frontier in Semiconductors
Traditional monolithic chip designs face mounting challenges as we continue to push the boundaries of computational power, energy efficiency, and cost-effectiveness. Enter chiplet-based architecture — an innovative solution poised to revolutionize semiconductor services and semiconductor solutions.
Solving the Skilled Tech Talent Gap in the Semiconductor Industry
By implementing strategic workforce management and partnering with experienced experts, semiconductor companies can effectively navigate the talent shortage, build a sustainable workforce, and position themselves for long-term success
PlayNitride Selects Veeco’s Lumina MOCVD System for MicroLED Production
Veeco Instruments Inc. today announced that PlayNitride has qualified Veeco’s Lumina MOCVD system for production of next-generation MicroLEDs, and also placed an order for two systems for delivery in 2025.
Launch of TRENG-PLP Coater: Panel Level Coater for Advanced Semiconductor Packaging
Toray Engineering Co., Ltd. has developed the TRENG-PLP Coater, a high-accuracy coating device for panel level packaging; PLP is an advanced semiconductor packaging technology.
The Rigaku Group’s XwinSys Changes its Name to Rigaku Semiconductor Instruments
To strengthen its manufacturing of equipment for advanced semiconductor packaging.
Student Research Supports Semiconductor Sustainability
TSMC-sponsored projects aim to improve use and manufacturing practices.
What’s in the November/December Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the November/December issue.
