Bruker Corporation today announced the launch of the nVista 2P miniature, two-photon microscope, a groundbreaking addition to the Inscopix product line for functional imaging of freely behaving animals.
Packaging
Lam Research Donates Leading-Edge Etch System to Accelerate Nanofabrication R&D at UC Berkeley
Lam Research Corp. today announced the donation of its innovative multi-chamber semiconductor etching system to the Marvell Nanofabrication Laboratory at the University of California, Berkeley to advance research and development (R&D) for next-generation chip technologies.
Driving Sustainable Manufacturing in ASEAN: The Ripple Effect of Validated Net-Zero Commitments
A promising pathway to achieving net-zero emissions in the manufacturing sector is through the adoption of validated commitments.
Micron Announces Business Unit Reorganization to Capitalize on AI Growth Across All Market Segments
Micron Technology, Inc. today announced a market segment-based reorganization of its business units to capitalize on the transformative growth driven by AI, from data centers to edge devices.
JEDEC and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard
JEDEC Solid State Technology Association today announced the publication of its highly anticipated High Bandwidth Memory (HBM) DRAM standard: HBM4.
SiC Schottky Diodes from Diodes Incorporated Deliver Industry-Leading FOM and System Efficiency
Diodes Incorporated today announces the expansion of its silicon carbide (SiC) product portfolio with a series of five high-performance, low figure-of-merit (FOM) 650V SiC Schottky diodes.
ASMC 2025 Showcases AI and Emerging Technologies Shaping the Future of Semiconductor Manufacturing
The 36th annual Advanced Semiconductor Manufacturing Conference (ASMC) 2025 will be held May 5-8, 2025, in Albany, New York, bringing together leaders in semiconductor manufacturing to explore cutting-edge advancements driving high-volume production and AI-powered innovation.
Applied Materials Announces a Strategic Investment in BE Semiconductor Industries
Purchased 9 percent of outstanding shares to build upon four years of successful collaboration on hybrid bonding technology for advanced packaging.
Infineon Launches World’s First Industrial GaN Transistor Product Family with Integrated Schottky Diode
Infineon Technologies AG has introduced the world’s first gallium nitride (GaN) power transistors with integrated Schottky diode for industrial use.
Canatu Signs Joint Development Agreement with DENSO to Improve Carbon Nanotube Performance
Canatu Plc has signed a one-year joint development agreement with DENSO Corporation, a supplier of automotive technology and components, to improve the performance of Canatu carbon nanotubes.
