Last night, the Global Semiconductor Alliance (GSA) celebrated its 30th anniversary and the achievements of remarkable individuals and exceptional semiconductor companies at its annual GSA Awards Ceremony gala.
Packaging
Smartkem Signs Multi-Year Agreement with FlexiIC to Develop a New Generation of CMOS for Smart Sensors
New project builds on ongoing collaboration to develop custom circuits using Smartkem’s organic transistor technology.
Intel Appoints Semiconductor Leaders Eric Meurice and Steve Sanghi to Board of Directors
Intel Corporation today announced that Eric Meurice, former president, chief executive officer and chairman of ASML Holding N.V., and Steve Sanghi, chairman and interim chief executive officer of Microchip Technology Inc., have been appointed to Intel’s board of directors, effective immediately.
YES Announces Release of VertaCure XP G3 Systems for Advanced Packaging Applications
YES announced today that it is releasing VertaCure XP G3 curing systems for production.
Soitec and GlobalFoundries Collaborate in the Production of High-Performance RF-SOI Semiconductors
Soitec announced today its commitment to deliver 300mm RF-SOI substrates to GlobalFoundries (GF) for the production of GF’s leading RF-SOI technology platforms, including the company’s most advanced RF solution, 9SW.
VSMC Celebrates Breaking Ground on 300mm Fab in Singapore
VisionPower Semiconductor Manufacturing Company Pte Ltd (VSMC), the joint venture formed in September, 2024 by Vanguard International Semiconductor Corporation and NXP Semiconductors N.V. today celebrated breaking ground at the site of the joint venture’s new 300mm wafer manufacturing facility in Tampines, Singapore.
GlobalFoundries GaN Chip Manufacturing Advances with $9.5 Million U.S. Federal Funding
Funding moves GF closer to large-scale production of next-generation gallium nitride chips for a range of RF and high-power applications.
Ampere and STMicroelectronics Collaborate on Powerbox with Long Term Supply for Silicon Carbide
Multi-year agreement between STMicroelectronics and Renault Group secures Ampere’s supply of Silicon Carbide power modules.
ASIC Supplier ICsense Selected for GlobalFoundries’ Official Design Partner Network
ICsense, a TDK Group Company and independent subsidiary specializing in the design of Application Specific Integrated Circuits (ASICs), has announced a new partnership with GlobalFoundries.
ULVAC Launches New Deposition System for Semiconductor Applications
ULVAC, Inc. has started accepting orders for the ENTRON-EXX, a new multi-chamber deposition system for semiconductor applications.
