Semtech Corporation today announced that its board of directors has appointed Paul H. Pickle as Semtech’s new president and chief executive officer.
Packaging
Nordson Test & Inspection Unveils New X-Ray Inspection System
Nordson Test & Inspection will unveil the new Quadra 7 Pro Manual X-Ray Inspection (MXI) system at SEMICON China.
ASM Breaks Ground on New Innovation and Manufacturing Center in Hwaseong, Korea
ASM International N.V. will take its symbolic first step in bringing its US$100 million multi-year investment in Hwaseong (Dongtan), South Korea, to fruition, with the groundbreaking ceremony tomorrow on its expanded innovation and manufacturing center.
Toshiba Releases Small Photorelay with High Speed Turn-On Time that Helps Shorten Test Time for Semiconductor Testers
Toshiba Electronic Devices & Storage Corporation has launched “TLP3476S,” a photorelay in the S-VSON4T package that cuts turn-on time to half that of Toshiba’s current product, TLP3475S. Volume shipments start today.
Alchip Technologies Sets Record Q1 Revenue
Historically strong artificial intelligent chip shipments to North American customer accounted for much of the significant jump in first quarter revenue, according to President and CEO Johnny Shen.
IEEE International Electron Devices Meeting (IEDM) Announces 2023 Call for Papers
Under the theme “Devices for a Smart World Built Upon 60 Years of CMOS,” the 69th annual IEEE International Electron Devices Meeting (IEDM) has issued a Call for Papers seeking the world’s best original work in all areas of microelectronics research and development.
Ayar Labs Adds $25 Million in Expansion of Its $130 Million Series C
Ayar Labs today announced it has raised an additional $25 million in Series C1 funding, bringing its total Series C raise to $155 million.
EV Group and Dymek Company Form Joint Venture Company in Malaysia
EV Group and Dymek Company today announced that they have established a new joint venture company in Malaysia.
SEMI North America Advisory Board Welcomes New Members From ASML and Breker Verification Systems
SEMI today announced the election of two new members to the SEMI North America Advisory Board (NAAB): Maheen Hamid, co-founder, CFO and COO of Breker Verification Systems, and Michael Lercel, Senior Director of Global Strategic Marketing at ASML.
Global Semiconductor Packaging Materials Market to Near $30 Billion by 2027
Powered by strong demand for new electronics innovations, the global semiconductor packaging materials market is expected to reach US$29.8 billion by 2027, a compound annual growth rate (CAGR) of 2.7% from the US$26.1 billion in revenue it logged in 2022.
