A fixture in the San Francisco Bay Area for more than 50 years, SEMICON West is moving to Phoenix for a five-year annual rotation starting in 2025 and shifting from its longstanding July event dates to October beginning in 2024, SEMI announced today.
Packaging
Quad-C Management to Acquire QED Technologies from Entegris
The transaction is expected to close in the first quarter of 2023, subject to receipt of required regulatory approvals and other customary closing conditions.
POET Technologies Announces a Strategic Collaboration with ADVA for Highly Integrated 4x100G Solutions
ADVA will use POET’s multi-engine transmit and receive chips in an innovative pluggable solution that packs the functionality of four independent 100Gbit/s interfaces into a single QSFP-DD housing.
Silanna UV Introduces TO-Can Package Format for 235nm and 255nm UV-C LEDs
Silanna UV announced the release of two new products in its SF1 235nm and SN3 255nm series of UV-C LEDs: the SF1-3T9B5L1 and the SN3-5T9B5L1.
proteanTecs to Showcase Interconnect Reliability Monitoring at the Chiplet Summit
proteanTecs announced today that the company will exhibit and present at the first annual Chiplet Summit.
Vertical Electrochemical Transistor Pushes Wearable Electronics Forward
Biomedical sensing is one application of efficient, low-cost transistors.
Foundry Revenue Is Forecasted to Drop by 4% YoY for 2023
TrendForce’s recent analysis of the foundry market reveals that demand continues to slide for all types of mature and advanced nodes.
Akoustis Receives First High-Volume 5G Mobile XBAW Filter Order from Tier-1 RF Component Company
The filter solution leverages one of Akoustis’ new wafer-level-packages (WLP), developed and manufactured in its Canandaigua, New York fab.
Melexis to Invest 70M EUR in Facility Expansion in Kuching, Malaysia
Melexis, a global supplier of micro-electronic semiconductor solutions, is expanding its facility in Kuching, Malaysia.
New All-in-One Hybrid Power Drive Module Solution from Microchip
The highly integrated and configurable three-phase power module is the first variant of the new family and can be customized using silicon carbide or silicon, reducing power solution size and weight for electric aircraft.
