Work by Sang-Hoon Bae, collaborators would make next-generation electronics faster, use less power.
Packaging
Presto Engineering Announces Leadership Change
Cédric Mayor appointed CEO of Presto Engineering Group and Michel Villemain appointed Executive Chairman.
Unravelling Auger Recombination in Bipolar Devices Under High Carrier Injection
Scientists experimentally determine the dependence of Auger recombination on excited carrier concentration.
Georgia Tech Receives $65 Million Grant from Semiconductor Research Corporation for JUMP 2.0 Centers
Two new research centers, representing an investment of about $65.7 million, have been awarded to Georgia Tech through the SRC-administrated Joint University Microelectronics Program 2.0, or JUMP 2.0.
U.S. Manufacturers Tackle Product, Supply Chain Challenges
Service providers are helping automakers transform vehicles and semiconductor companies adapt to geopolitical and pandemic disruptions.
Advantek Acquires LKTT Plastic Technology in Malaysia
Advantek, LLC, a provider of highly engineered carrier tape and precision component packaging, today announced the acquisition of LKTT Plastic Technology Sdn. Bhd., a provider of complementary precision packaging based in Malaysia.
IMAPS Device Packaging Conference Returns to Arizona in March 2023
The 19th Annual Device Packaging Conference (DPC 2023) will be held March 13-16, 2023, at the WeKoPa Resort and Conference Center in Fountain Hills, Arizona.
Global Semiconductor Sales Decrease 2.9% Month-to-Month in November
Worldwide chip sales down 9.2% year-to-year.
Chiplet Summit Promotes Higher Design Productivity at Leading-Edge Nodes
Chiplet Summit, to be held January 24-26 at the Doubletree by Hilton San Jose Hotel, will help designers go-to-market faster by using the latest design architecture – chiplets.
Kandi Technologies Announces CEO Transition
Kandi Technologies Group, Inc. today announced the appointment of Dr. Xueqin Dong as Chief Executive Officer, effective January 10, 2023.
