Is this the year of rapid graphene sales? Are we slipping deeper into a disillusionment phase? Who will emerge as the market leaders? Is consolidation inevitable? 2023 will be a telling year for the industry.
Packaging
Samsung Electronics Unveils High-Performance PC SSD
Built with a market-leading 5nm controller and seventh-generation V-NAND, the PM9C1a will enable a new level of everyday PC efficiency, while also handling demanding computing and gaming tasks.
ROHM’s Fourth Generation SiC MOSFETs to be Used in Hitachi Astemo’s Inverters for Electric Vehicles
Contributing to longer cruising range and smaller systems in electric vehicles both in Japan and overseas from 2025.
Micron DDR5 Delivers Increased Performance and Reliability for the 4th Gen Intel Xeon Scalable Processor Family
Micron Technology, Inc. today announced that its DDR5 server memory portfolio for the data center is now fully validated on the 4th Gen Intel Xeon Scalable processor family.
POET Technologies Announces Production Release of Optical Engines for 100G, 200G and 400G for Telecom and Data Center Market
Achievement marks commercialization milestone for products built with proprietary wafer-level chip-scale packaging technology.
Slowing Industry Conditions Temporarily Eases Supply Strain in 2023 for Silicon and SOI Wafers
Investments in increased capacity not expected to alleviate strain until 2024-2025.
STPOWER Automotive-Grade Devices from STMicroelectronics Run Cooler in Surface-Mount ACEPACK SMIT Package
STMicroelectronics has introduced five power-semiconductor bridges in popular configurations, housed in ST’s advanced ACEPACK SMIT package that eases assembly and enhances power density over conventional TO-style packages.
Micron Delivers High-Performance Data Center SSD to Power the Most Demanding Workloads
Micron Technology, Inc. today announced the Micron 9400 NVMe SSD is in volume production and immediately available from channel partners and to global OEM customers for use in servers requiring the highest levels of storage performance.
Three in Four Semiconductor Executives Expect Supply Chain Challenges to Ease by 2024, Accenture Report Finds
Continued investment in innovation critical to semiconductor growth, including metaverse, digital health, mobility and sustainability.
Quadric and ams OSRAM Collaborate to Bring Intelligent Image Sensors’ Demonstration to CES
Quadric and ams OSRAM today announced a strategic collaboration to develop integrated sensing modules combining ams OSRAM’s leading edge Mira Family of CMOS sensors for visible and infrared with Quadric’s novel Chimera GPNPU processors.
