Construction will start in June 2024, with production scheduled to start in spring 2025.
Packaging
Moore’s Law Inevitable Decline Opens New Path to IC Innovation
“Moore’s Law” will inevitably come to a screeching halt, says Monozukuri CEO and Founder, Anna Fontanelli.
KLA Foundation Invests More Than $1 Million in Bay Area and Michigan Nonprofits
KLA Corporation today announced the KLA Foundation recently distributed more than $1 million in grants and donations to support social equity, access, and education with an emphasis in science, technology, engineering and math (STEM) in the Bay Area and Southeast Michigan this December.
Wolfspeed Expands and Extends Silicon Carbide Wafer Supply Agreement with a Leading Global Semiconductor Company
$225 million dollar expanded supply agreement supports steepening demand for Silicon Carbide across several key industries and among traditional semiconductor companies.
Plasma-Therm Receives Follow-On Order in Japan for its Heatpulse RTP System
Innovative platform redesign enables device makers to make critical system upgrades for currently installed legacy systems without interrupting processes of record.
SEMI ISS Europe 2023 to Spotlight European Chips Act with Focus on Growth, Talent, Sustainability and Supply Chain
Leading analysts, economists, policymakers and technologists will gather at the SEMI Industry Strategy Symposium Europe (ISS Europe) 2023, February 15-16 in Vienna, Austria, to provide the latest insights into major forces impacting the global semiconductor industry.
Arizona State University to Advance Proposal for CHIPS and Science Act Funding
ASU will offer regionally collaborative proposal to advance microelectronics research, development and manufacturing in Arizona and southwest region as part of national network.
Applied Materials Breakthrough in Electron Beam Imaging Technology Accelerates Development of the World’s Most Advanced Computer Chips
Applied Materials, Inc. today announced the commercial availability of “cold field emission” (CFE) technology, a breakthough in eBeam imaging that enables customers to better detect and image nanometer-scale, buried defects to speed the development and production of next-generation Gate-All-Around (GAA) logic chips as well as higher-density DRAM and 3D NAND memories.
SEMICON Japan 2022 Opens Tomorrow to Showcase Cutting-Edge Technologies Powering Semiconductor Industry Growth
Opening keynote panel to feature Rapidus representatives discussing strategies for strengthening Japan’s semiconductor industry.
Syntiant Named 2022’s ‘Start-Up to Watch’ by the Global Semiconductor Alliance
Syntiant Corp., a provider of deep learning solutions for always-on edge AI voice, sensor and vision applications, today announced that the company was named 2022’s “Start-Up to Watch” during this year’s Global Semiconductor Alliance (GSA) Awards.
