SEMI, the industry association serving the global electronics design and manufacturing supply chain, today applauded the provisional agreement reached yesterday in the European Chips Act Trilogue Negotiations to invest €43 billion to bolster Europe’s microelectronics industry.
Packaging
Marvell Demonstrates Industry’s First 3nm Data Infrastructure Silicon
Marvell Technology, Inc. has demonstrated high-speed, ultra-high bandwidth silicon interconnects produced on Taiwan Semiconductor Manufacturing Company’s (TSMC) 3-nanometer (3nm) process.
SK hynix Develops Industry’s First 12-Layer HBM3
SK hynix Inc. announced today it has become the industry’s first to develop 12-layer HBM3 product with a 24 gigabyte (GB) memory capacity, currently the largest in the industry, and said customers’ performance evaluation of samples is underway.
SkyWater President and CEO Thomas Sonderman to Deliver Keynote at 2023 ASMC
Keynote to highlight impact of CHIPS Act on semiconductor manufacturing sector and importance of secure sources for critical emerging technology innovations.
Monozukuri Cracks the Code to IC/Package Co-optimization
Anna Fontanelli, Monozukuri S.p.A. CEO and Founder, demonstrated MZ-GENIO, the first integrated IC/Packaging EDA tool, during the “Advanced 3D architecture and design methodology” session at DATE on Wednesday in Antwerp, Belgium.
Take a Look Inside a Vacuum Gauge: Pfeiffer Vacuum Publishes Easy-to-Understand Videos
To assist in choosing the right measurement principle, Pfeiffer Vacuum has made helpful explanatory videos that give a detailed insight into the inner workings and functionality of vacuum gauges.
U.K.’s Space Forge Announces Plans to Launch U.S. Manufacturing Operations
U.K.-based Space Forge Ltd., which is pioneering space-based super materials manufacturing, announced today it is launching operations in the United States.
Purdue Convenes CHIPS Summit in D.C. With Sec. Raimondo and Sen. Young
Leaders from industry, government and academia convened at a summit Tuesday (April 18) in Washington, D.C. to forge national solutions at scale to address the future of U.S. innovation in microelectronics and the semiconductor workforce.
SIA Applauds House Introduction of Bipartisan Legislation to Restore Immediate Deductibility of R&D Investments
The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer commending the introduction in the House of Representatives of bipartisan legislation to restore full tax deductibility of R&D investments.
Cellcom Telecommunications Israel Plans to Roll Out Independent 5G Network
Cellcom Telecommunications Israel and Parallel Wireless Inc are launching a unique, first-of-its-kind experiment to deploy a standalone 5th generation (5G SA) network for autonomous 5G.
