NextFlex, America’s Flexible Hybrid Electronics (FHE) Manufacturing Institute, today announced $8.45 million in funding (including $4.25M in cost-share contribution from participants) for nine new projects as part of its Project Call 7.0 to further promote FHE development and adoption throughout the U.S. advanced manufacturing sector.
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ROHM and BASiC Semiconductor Form a Strategic Partnership
Contributing to the technical innovation of new energy vehicles through the development of automotive SiC power devices.
Dr. Nissan Cohen, Ex-Founder/CEO of Tower Semiconductor, Joins Nano Dimension’s Board of Directors
Dr. Yoav Nissan-Cohen will replace Mr. Yaron Eitan, who has served on the board of Nano Dimension since March 2020 and has stepped down as Dr. Nissan-Cohen joined.
SEMI Commends European Council’s Progress on Chips Act, Urges Swift Start of Trialogue Negotiations
SEMI, the industry association serving the global electronics design and manufacturing supply chain, today applauded the progress on the European Chips Act by the European Council, expressing strong support for the swift start of the negotiations in 2023.
Lattice Semiconductor Appoints Douglas Bettinger to Board of Directors
Lattice Semiconductor, the low power programmable leader, today announced the appointment of Douglas Bettinger to the Company’s Board of Directors and Audit Committee effective December 2, 2022.
The MOSIS Service of the USC Information Sciences Institute and SkyWater Collaborate on Silicon IC Design Enablement and Manufacturing Service
The MOSIS Service will provide multi-project wafer (MPW) shuttle access to SkyWater’s S90 and S130 mixed-signal CMOS technologies.
Global Semiconductor Equipment Billings Increase 9% in Q3 2022, SEMI Reports
Global semiconductor equipment billings rose 9% from the second to the third quarter of 2022 and 7% year-over-year to US$28.75 billion, SEMI announced today.
STMicroelectronics and Soitec Cooperate on SiC Substrate Manufacturing Technology
STMicroelectronics and Soitec announce the next stage of their cooperation on Silicon Carbide (SiC) substrates, with the qualification of Soitec’s SiC substrate technology by ST planned over the next 18 months.
What’s in the November/December Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the November/December issue.
Making Sense of Coercivity in Magnetic Materials with Machine Learning
Scientists develop a meaningful approach to analyze how a material’s microstructure relates to its macroscopic physical properties.
