Samsung Electronics Co., Ltd. today announced it has successfully developed the industry’s first PCIe 4.0 automotive SSD based on eighth-generation vertical NAND (V-NAND)
Packaging
New CEA-Leti Technology Improves DC-DC Converter Efficiency and Paves the Way to Piezoelectric Converters Without Transformers
Building on its earlier breakthroughs introducing a new way of converting electrical power using piezoelectric resonators and developing a dual-bridge piezoelectric resonator converter, CEA-Leti has paved the way to isolating piezoelectric converters without transformers.
Soitec and Resonac Announce the Signing of a Joint Development Agreement
Resonac Corporation and Soitec have signed an agreement to develop 200mm (8-inch) SmartSiC silicon carbide (SiC) wafers using Resonac substrates and epitaxy processes, in a major step for the deployment of Soitec’s high-yielding silicon carbide technology in Japan and other international markets.
SIA Urges House Passage of Bipartisan Bill to Streamline Environmental Review of CHIPS Projects
The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer urging the House of Representatives to pass the Building Chips in America Act (S. 2228).
Jabil Expands Silicon Photonics Capabilities to Enable Next-Generation AI and Data Center Technologies
Jabil Inc. today announced its continued investment in silicon photonics-based products and capabilities to support the increasing demands of hyperscalers and next-wave cloud and AI data center growth.
The MMEC Receives Microelectronics Commons Project Awards
The Midwest Microelectronics Consortium (MMEC) announced the award of five technology development projects through Microelectronics Commons
ROHM’s New N-Channel MOSFETs Offer High Mounting Reliability in Automotive Applications
ROHM Semiconductor today announced new N-channel MOSFETs featuring low ON-resistance ideal for a variety of automotive applications, including motors for doors and seat positioning, as well as LED headlights.
Resonac Develops Temporary Bonding Film and New Debonding Process for Advanced Semiconductor Packages
Resonac Corporation has developed a temporary bonding film to be used for supporting a wafer on a glass carrier temporarily in the semiconductor device fabrication process (front-end process) and semiconductor packaging process (back-end process), as well as its debonding process.
NORDTECH R&D Projects Selected to Receive $30M in Federal Awards from U.S. Department of Defense
These projects are set to receive a total of more than $30 million in the technical areas of quantum and commercial leap ahead technologies.
White House, DOD Officials Award $29.6.M for 5 SWAP Hub Projects
CHIPS Act investment powers collaborative effort to advance US microelectronics manufacturing.
