GaN to reach adoption tipping points in multiple industries, further driving energy efficiency.
Packaging
SIA Applauds House Introduction of Legislation to Strengthen American Chip Manufacturing and Design
The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer commending the introduction in the U.S. House of Representatives of the bipartisan Semiconductor Technology Advancement and Research (STAR) Act.
Magnetically Levitated Turbomolecular Pumps for Coating, Research and Industry
EDWARDS VACUUM has developed a new series of magnetically levitated turbomolecular pumps that can withstand the demands of both challenging industrial environments and research processes.
Sunny Stalnaker of ASML to Receive SEMI Sales and Marketing Excellence Award
SEMI today announced that Sunny Stalnaker of ASML has won the 2025 SEMI Sales and Marketing Excellence Award, inspired by Bob Graham.
Foundries in Europe 2024
Europe will be ready to grow again its market share but should maintain the current status quo and still source about 50% of production abroad.
MTR Carbon Capture Selected to Provide a Capture Plant to TSMC
MTR Carbon Capture has been contracted by Taiwan Semiconductor Manufacturing Company (TSMC) to supply a Polaris membrane carbon capture system to treat emissions from a TSMC solvent incineration facility in Taiwan.
SPIE and Boston University Announce $1 Million Endowment for Graduate and Postgraduate Scholarships
SPIE, the international society for optics and photonics, and Boston University (BU) announced the establishment of the SPIE-Boston University Scholarship in Photonics during SPIE Photonics West in San Francisco.
TANAKA Develops AgSn TLP Sheet, A Bonding Material for Power Semiconductors
Compatible with large chip sizes of 20mm, enabling highly reliable bonding over extensive areas and contributes to growing demand for high-current power semiconductors in electric vehicles, hybrid automobiles, industrial infrastructure, etc.
Amtech Appoints New Member to Board of Directors
Amtech Systems, Inc., a manufacturer of equipment and consumables for semiconductor fabrication and packaging, today announced the appointment of Asif Y. Jakwani to its Board of Directors.
Numem Overcomes AI Performance Barriers with Next-Gen Memory Solutions, Highlights Innovations at Chiplet Summit
Numem will be at the upcoming Chiplet Summit to showcase its high-performance solutions. By accelerating the delivery of data via new memory subsystem designs, Numem solutions are re-architecting the hierarchy of AI memory tiers to eliminate the bottlenecks that negatively impact power and performance.
