Samsung Electronics Co., Ltd. today announced it has developed the industry’s first 24-gigabit (Gb) GDDR7 DRAM.
Packaging
Microchip’s RTG4 FPGAs with Lead-Free Flip-Chip Bumps Achieve Highest Space Qualification
QML Class V designation recognizes exceptional reliability and longevity for critical space missions.
Infinera Receives CHIPS and Science Act Funds to Support Development of Semiconductor Technology Important for Communications and National Security
Today, the Biden-Harris Administration announced that the Department of Commerce and Infinera have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $93 million in proposed direct funding under the CHIPS and Science Act.
KLA Unveils Comprehensive IC Substrate Portfolio for a New Era of Advanced Semiconductor Packaging
Today KLA Corporation introduced the industry’s widest breadth of process control and process-enabling solutions for IC substrate (ICS) manufacturing.
Forge Nano Receives $10M Investment from GM Ventures
GM plans to utilize Forge Nano’s Atomic Armor surface engineering platform technology to pursue battery cathode material enhancements.
Rambus Unveils Industry-First Complete Chipsets for Next-Generation DDR5 MRDIMMs and RDIMMs
Rambus Inc. today unveiled industry-first, complete memory interface chipsets for Gen5 DDR5 RDIMMs and next-generation DDR5 Multiplexed Rank Dual Inline Memory Modules (MRDIMMs).
Intel and AMD Form x86 Ecosystem Advisory Group
Intel Corp. and AMD today announced the creation of an x86 ecosystem advisory group bringing together technology leaders to shape the future of the world’s most widely used computing architecture.
Biden-Harris Administration Announces Preliminary Terms with Wolfspeed
Proposed CHIPS investment of up to $750M would support construction of world’s largest silicon carbide 200mm ecosystem and create over 5,000 jobs in North Carolina and New York.
Mouser Electronics Celebrates Its 2024 Best-in-Class Award Winners
Mouser Electronics, Inc. announced the 2024 recipients of the Mouser Best-in-Class Awards. The annual awards event occurred on October 10 near the global distributor’s corporate headquarters in the Dallas/Fort Worth Metroplex.
SEMICON Europa 2024 to Explore Innovations in Advanced Packaging and Fab Management for a Sustainable Future
Semiconductor industry experts will convene at SEMICON Europa 2024, November 12-15 at Messe München in Munich, to explore the latest trends and innovations in advanced packaging and fab management.
