Department received 200 statements of interest for semiconductor projects across 35 states.
Packaging
GigaDevice’s Industry-Leading Automotive Flash Memory Achieves 100 Million Units Shipment Milestone
GigaDevice, a semiconductor industry leader in flash memory, 32-bit microcontrollers (MCUs), sensors, and analog technology, announces the milestone of shipping 100 million units of its leading automotive-grade (AEC-Q100) GD25/55 SPI NOR and GD5F SPI NAND flash series.
Global Semiconductor Equipment Billings Reach Industry Record $107.6 Billion in 2022, SEMI Reports
Worldwide sales of semiconductor manufacturing equipment increased 5% from $102.6 billion in 2021 to an all-time record of $107.6 billion last year.
ZF Signs Multi-Year Supply Agreement with STMicroelectronics for Silicon Carbide Devices
The technology group ZF will, from 2025, purchase silicon carbide devices from STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications.
CEA-Leti to Report Progress on 3D Interconnects for Wafer-Level Platforms At Electronic Components and Technology Conference, May 30-June 2
CEA-Leti will present seven papers on 3D interconnects focused primarily on semiconductor wafer-level platforms at the Electronic Components and Technology Conference (ECTC), May 30-June 2, in Orlando, Fla.
3D-Micromac Shortens Atom Probe Tomography Sample Prep Time From Hours to Minutes With New Laser Micromachining System
3D-Micromac AG today introduced the microPREP PRO FEMTO laser micromachining system for high-speed Atom Probe Tomography (APT) and cross-section sample preparation.
Lightelligence Joins Global Semiconductor Alliance
Lightelligence today became a member of the Global Semiconductor Alliance (GSA), the voice of the global semiconductor industry.
Women in Semiconductors 2023 to Highlight Bridging the Gender Gap Through Allyship
The vital importance of workplace inclusion and diversity to the growth of the global semiconductor industry will take center stage as the Women in Semiconductors (WiS) program returns in-person on May 1 in conjunction with the SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2023) in Saratoga Springs, New York.
Renesas Samples Its First 22nm Microcontroller
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, today announced that it has produced its first microcontroller (MCU) based on advanced 22nm process technology.
Mark Lewis Named Inaugural CEO of Purdue Applied Research Institute
Purdue University announced Tuesday (April 11) the hire of Mark Lewis as the first chief executive officer of the Purdue Applied Research Institute (PARI), the nonprofit applied research arm of Purdue with a particular focus on national security, economic security and food security for the United States.
