Kyocera Corporation today announced that it has reached an agreement to acquire about 37 acres of land for a new smart factory at the Minami Isahaya Industrial Park in Isahaya City, Nagasaki Prefecture.
Packaging
FLEX Conference 2023 to Spotlight Latest Flexible Hybrid Electronics, Printed Electronics and Advanced Packaging Innovations
FLEX Conference will gather industry experts July 11-13, 2023, at the Moscone Center in San Francisco for keynotes, panel discussions, technical sessions and product-based demonstrations highlighting the latest innovations in flexible hybrid electronics (FHE), printed electronics and advanced packaging including heterogeneous integration.
Blue Ocean Smart System Unveils Chiplet-Based Products Powered by VeriSilicon’s High-Performance Processors
VeriSilicon today announced Blue Ocean Smart System, an AI chiplet and SoC design company, has deployed high-performance AI chips with scalable chiplet architecture powered by multiple processors from VeriSilicon
Semiconductor Research Corporation announces 2023 Call for Research, $16.5M in Funding Opportunities
Semiconductor Research Corporation (SRC) is announcing the launch of solicitation season. Calls for research will begin in early April and will run through May.
Kioxia and Western Digital Announce Newest 3D Flash Memory
Demonstrating continued innovation, Kioxia Corporation and Western Digital Corp. today announced details of their newest 3D flash memory technology.
JCET Accelerates Technology Upgrades and Transformation in 2022
JCET Group, a global provider of integrated circuit (IC) manufacturing and technology services, today announced its full year financial results for the year ended December 31, 2022.
Georgia Tech and GlobalFoundries to Collaborate on Joint Semiconductor Research and Workforce Development
New partnership to include educational opportunities for Georgia Tech students and faculty, STEM outreach, and joint R&D programs on GF technology.
Global Wafer Level Optics Market to Reach US$ 24,908M by 2031 at Staggering CAGR of 51.07%
Additionally, the market is also expected to see a growth in volume, with a CAGR of 50.68% during the same period.
Industrial-Grade Silicon Carbide MOSFET from Diodes Incorporated Enables Higher Power Density
Diodes Incorporated introduces the latest addition to its portfolio of Silicon Carbide (SiC) products: the DMWS120H100SM4 N-channel SiC MOSFET.
U.S. Secretary of Commerce Gina Raimondo Announces Fiber Manufacturing Expansions in North Carolina
Today, as part of the Biden-Harris Administration’s Investing in America tour, U.S. Secretary of Commerce Gina Raimondo and Assistant Secretary of Commerce for Communications and Information Alan Davidson traveled to Hickory, NC to celebrate the announcement of new fiber optic cable production in the U.S. made possible by the Administration’s Internet for All Initiative.
