Company broadens portfolio to include next-generation substrates and panel-level processes for heterogeneous semiconductor solutions.
Packaging
Plasma-Therm Strengthens Presence in Europe to Collaborate With Customers on New Microelectronics Development
The company’s European facility, equipped with advanced R&D, manufacturing and demo cleanrooms, is poised to support new application and product development with strategic customers and partners in the region.
Moov Closes $41M Series A Round Led by Tiger Global to Help Solve the Global Chip Shortage
Moov, a data-fueled marketplace for used manufacturing equipment, today announced the close of a $41 million Series A funding round led by Tiger Global.
PEER Group Showcasing Automation Expertise at SEMICON Europa
PEER Group, the largest supplier of innovative factory automation software products is excited to attend SEMICON Europa 2022, happening November 15-18 at Messe München in Munich, Germany.
Industry Strategy Symposium 2023 to Highlight ‘Reaching $1T the Right Way: A Sustainable Path’
SEMI announced today that Industry Strategy Symposium (ISS) 2023 will be held January 8-11 at the Ritz-Carlton in Half Moon Bay, Calif. with the theme Reaching $1T the Right Way: A Sustainable Path.
SEMICON Europa 2022 Opens Tomorrow with Focus on Accelerating Semiconductor Industry Innovation
Industry experts from across the electronics design and manufacturing supply chain will gather starting tomorrow at SEMICON Europa 2022 for the latest developments and trends across key semiconductor industry growth segments.
After 1Q23 Bottom, Expectations Increase for a 2Q23 IC Market Rebound
Notably, the IC market has never shown more than three sequential quarters of decline.
Micron DDR5 Memory Now Available for 4th Gen AMD EPYC Processors
Micron Technology, Inc. today announced availability of DDR5 memory for the data center that is validated for the new AMD EPYC 9004 Series processors.
ACM Research Adds Metal Lift Off Capability to Ultra C pr Tool to Support Power Semiconductor Manufacturing and Wafer Level Packaging Applications
ACM Research, Inc. today announced that it has expanded its Ultra C pr product offering to include metal lift-off (MLO) capabilities for power semiconductor manufacturing and wafer level packaging (WLP) applications.
Nexperia Invests in Sustainable Alternatives to Batteries
Nexperia, the expert in essential semiconductors, today announced a broadening to its portfolio of power management products to include energy harvesting solutions.
