Trelleborg Sealing Solutions showcases two new additions to its Isolast PureFab FFKM material range at Semicon Europa 2022 at Neue München, Munich, Germany, at booth number C1.842 from November 15 to 18.
Packaging
Xiphera and Flex Logix Publish Joint White Paper on Solving the Quantum Threat with Post-Quantum Cryptography on eFPGA
Xiphera Ltd, a Finnish company designing and licensing cryptographic IP cores for FPGAs and ASICs, announced today that it has published a new white paper with Flex Logix.
ASE Breaks Ground on New Chip Assembly and Testing Facility in Penang, Malaysia
The new facility at ASE Malaysia (ASEM) will comprise 2 buildings (Plants 4 and 5) with a built-up area of 982,000 square feet, located in the Bayan Lepas Free Industrial Zone.
Ayar Labs Expands Executive Team to Lead the Next Phase of Growth in Optical I/O Production and Broad Commercial Adoption
Ayar Labs has expanded its executive team to further commercial development, with the addition of Lakshmikant (LK) Bhupathi, Vice President of Products, Strategy and Ecosystem, and Scott Clark, Vice President of Manufacturing and Operations.
Electrically Conductive Adhesive from Henkel Designed to Accommodate Compact Camera Module Complexity
Henkel continues to lead in consumer electronic material solutions and today announced its latest innovation, an electrically conductive adhesive (ECA) that cures at room temperature, improving yield rates and protecting sensitive structures within mobile device compact camera modules (CCMs).
Tektronix Partners with BRIDG to Boost Domestic Semiconductor Package Testing
This collaboration will expand advanced semiconductor package testing capabilities in the US.
Provider of Diamond Semiconductor Wafers, DIAMFAB, Unveils New Strategy and Technology Vision
DIAMFAB, a start-up innovator of high value-added diamond semiconductor wafer technology for next-generation electronics, today announced that the company will move to a new dual business model strategy.
GSA Announces 2022 Award Nominees
The prestigious awards will be presented at GSA’s Awards Celebration on Thursday, Dec. 8, 2022.
Global Silicon Wafer Shipments Projected to Set New Record in 2022, SEMI Reports
Global silicon wafer shipments are projected to increase 4.8% year-over-year in 2022 to a record high of nearly 14,700 millions of square inches (MSI), SEMI reported today in its annual silicon shipment forecast for the semiconductor industry.
EV Group Advances Leadership in Optical Lithography with Next-Generation EVG150 Resist Processing Platform
Redesigned 200mm platform increases module capacity for higher throughput, improves architecture for reduced tool footprint all while maintaining industry-leading capabilities of previous-generation platform.
