TECHCET and TechSearch International, Inc. recently announced that the market for Semiconductor Packaging Materials totaled US$26.1 billion in revenues for 2022, and is forecasted to approach US$30 billion in 2027.
Packaging
New SIA Map Highlights Broad U.S. Semiconductor Ecosystem
The semiconductor ecosystem in the United States is broad and diverse, as illustrated by SIA’s new U.S. Semiconductor Ecosystem Map, a first-of-its-kind tool that allows users to explore industry activities across the country, including nearly 500 locations in 42 states.
New Chip Design to Provide Greatest Precision in Memory to Date
A team led by USC, MIT, and the University of Massachusetts, developed a protocol for devices to reduce “noise” and demonstrated the practicality of using this protocol in integrated chips.
ACM Research Receives First Purchase Order for Ultra C SiC Substrate Cleaning Tool
The platform leverages ACM’s patented Space Alternated Phase Shift (SAPS) cleaning technology which is designed to achieve more comprehensive cleaning without damage to device features.
Adeia Signs Long-Term Semiconductor Patent License Agreement with Kioxia
Adeia Inc., the company whose patented innovations enhance billions of devices, today announced that Kioxia Corporation entered into a long-term agreement to license Adeia’s semiconductor patent portfolio, including those relating to hybrid bonding.
Pfeiffer Vacuum Offers a New Vacuum Calculator
Pfeiffer Vacuum offers their customers a vacuum calculation tool to identify specific vacuum products for their application, examine evacuation as well as pump down curves and perform different calculations for self-configurated pumping solutions.
New Resources for CHIPS Applicants
Today, the Department of Commerce is releasing pre-application and application instructions, guidebooks, and other resources for the first CHIPS for America funding opportunity for leading-edge, current-generation, mature-node, and back-end semiconductor fabrication facilities.
Park Systems Introduces Park NANOstandard for Traceable Calibration Standards
Park Systems, a provider of Atomic Force Microscopy (AFM) and nano-metrology solutions, announced the launch of its Park NANOstandard product line.
2026 All-Time High in Store for Global 300mm Semiconductor Fab Capacity After 2023 Slowdown, SEMI Reports
After strong growth in 2021 and 2022, the 300mm capacity expansion is expected to slow this year due to soft demand for memory and logic devices.
Gordon Moore, Intel Co-Founder, Dies at 94
Intel and the Gordon and Betty Moore Foundation announced that company co-founder Gordon Moore died on March 24, 2023, at the age of 94.
