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Packaging
Semiconductor Climate Consortium Representatives to Present During 2022 United Nations Climate Change Conference (COP27)
SEMI today announced that members of the new Semiconductor Climate Consortium (SCC) will discuss key aspects of the group’s vision, goals and membership at two sessions during COP27 in Sharm El-Sheik, Egypt.
Samsung Electronics Begins Mass Production of 8th-Gen Vertical NAND with Industry’s Highest Bit Density
Samsung Electronics Co., Ltd., as promised at Flash Memory Summit 2022 and Samsung Memory Tech Day 2022, announced today that it has begun mass producing a 1-terabit (Tb) triple-level cell (TLC) eighth-generation Vertical NAND (V-NAND) with the industry’s highest bit density.
What the CHIPS and Science Act Could Mean for Domestic Semiconductor Manufacturing Innovation
It’s important for semiconductor companies to utilize the CHIPS Act funding as effectively as possible. One way to do this is by switching to a chiplet-based design flow.
Aehr Receives Over $4 Million in Orders for its FOX WaferPak Full Wafer Contactors
These WaferPak Contactors are expected to ship by the end of Aehr’s fiscal third quarter ending February 28, 2023.
CyberOptics Corporation Acquired by Nordson Corporation
CyberOptics Corporation today announced Nordson Corporation has completed its acquisition of CyberOptics.
SiFive’s New High-Performance Processors Offer a Significant Upgrade for Wearable and Consumer Products
SiFive, Inc. today announced two new products that address the need for high performance and efficiency in a small size in high volume applications like wearables, smart home, industrial automation, AR/VR, and other consumer devices.
Purdue Partners with IIT Madras to Create Semiconductor Dual-Degree Program
Purdue University and the Indian Institute of Technology Madras (IIT Madras) will soon launch a dual-degree master’s program in semiconductors as part of a newly signed agreement to cooperate in education and research in semiconductors and microelectronics.
Canada’s Semiconductor Council Announces Managing Director
Canada’s Semiconductor Council (CSC) announced Dr. C. Paul Slaby as Managing Director, effective November 1, 2022.
Si2 Board Welcomes New Representatives from Leading EDA Providers
Silicon Integration Initiative today announced it has welcomed Michael Jackson, corporate vice president of research and development at Cadence Design Systems, and Jacob Avidan, senior vice president of engineering at Synopsys, to the Si2 board of directors.
