Dell’Oro Group announced today the launch of its new Data Center IT Semiconductors and Components advanced research report.
Packaging
Global High Bandwidth Memory Market to Hit Sales of US$ 3,433.8 Million by 2031
The global high bandwidth memory market is projected to reach US$ 3,433.8 million by 2031 up from US$ 292.7 million in 2022, at a CAGR of 31.3% during the forecast period 2023-2031.
Bare Die SiC from ROHM Chosen by Apex Microtechnology for Newest Line of Power Modules
ROHM Semiconductor today announced that precision power analog company Apex Microtechnology is adopting ROHM’s silicon carbide (SiC) MOSFETs and SiC Schottky Barrier Diode (SBD) for a new line of power modules.
Global Fab Equipment Spending on Track for 2024 Recovery After 2023 Slowdown, SEMI Reports
The 2023 decline will stem from weakening chip demand and higher inventory of consumer and mobile devices.
Intel Appoints Stuart Pann to Lead Intel Foundry Services
Intel Corporation today announced the appointment of Stuart Pann as senior vice president and general manager of Intel Foundry Services (IFS), Intel’s commercial foundry business.
What’s in the March Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the March issue.
Commerce Department Outlines Proposed National Security Guardrails for CHIPS for America Incentives Program
Guardrails will ensure innovations and technology funded by CHIPS Act bolsters technological and national security for America and our allies.
Samsung Announces Ultra-Wideband Chipset with Centimeter-Level Accuracy for Mobile and Automotive Devices
Samsung Electronics Co., Ltd. today announced its first ultra-wideband (UWB) chipset, the Exynos Connect U100. With single-digit centimeter accuracy, the new UWB solution is optimized for use in mobile, automotive and Internet of Things (IoT) devices, offering precise distance and location information.
DNP Develops TGV Glass Core Substrate for Semiconductor Packages
Dai Nippon Printing Co., Ltd. has developed a Glass Core Substrate (GCS) targeting next-generation semiconductor packages.
SEMICON West 2023 to Highlight Supply Chain Management, Sustainability and Workforce Development in Drive to $1 Trillion and Net Zero
Focusing on Building a Path Forward for the global semiconductor industry’s drive to $1 trillion and net zero, SEMICON West 2023 will gather industry experts and leaders July 11-13 at the Moscone Center in San Francisco for insights into the latest trends and innovations in sustainability, supply chain management, workforce development and other critical industry issues.
