The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer commending the introduction in Congress of bipartisan legislation to restore full tax deductibility of R&D investments.
Packaging
Amtech Systems Receives Large Repeat Order for Advanced Packaging Reflow Systems
Amtech Systems, Inc. announced today a multi-unit order for high volume reflow systems used in advanced packaging applications.
Silicon Labs Announces New Bluetooth SoC and MCU Ideal for Small Form-Factor Devices
Silicon Labs today announced two new integrated circuit families designed for the smallest form factor IoT devices: the xG27 family of Bluetooth systems on chips (SoCs) and the BB50 microcontroller unit (MCU).
Henkel Delivers Versatile, High Thermal Die Attach Adhesive for Power IC Applications
Henkel today announced the availability of a die attach adhesive that provides high thermal capability to enable superior operation of power semiconductor packages.
Proposal Submitted to Create Northeast Microelectronics Coalition
The Center for Advanced Manufacturing at MassTech Collaborative (CAM) and more than 85 organizations from across the Northeast have submitted a proposal to the federal government to create the Northeast Microelectronics Coalition.
Finalists Selected for Round Six of Luminate NY
Empire State Development (ESD) announced the 10 companies selected to take part in round six of the Luminate NY accelerator program, investment fund, and competition.
IMAPS Advanced System-in-Package Conference is Now CHIPcon
The top global event for advanced Chiplet and Heterogeneous Integration Packaging (CHIP) technologies to be held in July 2023.
Micron Releases ‘We Are Micron’ 2022 Diversity, Equality and Inclusion Report
Initiatives creating readiness for the workforce of the future and highlighting ongoing commitment to diversity.
Electric Vehicle Components Market Is Estimated To Be Valued At US$ 1001.95 Billion By 2032
The market is further expected to gain size of USD 1001.95 Billion by the year 2032. The market is expected to grow with a CAGR of 21.05% in the forecast period.
Tower Semiconductor Announces World’s First Heterogeneous Integration of Quantum Dot Lasers on its Popular SiPho Foundry Platform PH18
Tower Semiconductor, a foundry of high-value analog semiconductor solutions, in collaboration with Quintessent, Inc, today announced the world’s first heterogeneous integration of GaAs quantum dot (QD) lasers and a foundry silicon photonics platform (PH18DB).
