The Georgia Tech School of Electrical and Computer Engineering (ECE) will be a significant contributor to overall success of the nation’s goal to increase domestic semiconductor production and solidify its microelectronics workforce as collaborative efforts by industry and government come into focus.
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JCET Hits New Highs for Performance in Q3
A record high third quarter in the company’s history.
TSMC Launches OIP 3DFabric Alliance to Shape the Future of Semiconductor and System Innovations
TSMC today announced the Open Innovation Platform (OIP) 3DFabric Alliance at the 2022 Open Innovation Platform Ecosystem Forum.
Micron Foundation, National Science Foundation and Schumer Announce $10 Million Commitment to Semiconductor Education
Micron Technology, Inc. and the Micron Foundation have announced a new partnership with the U.S. National Science Foundation (NSF), committing to a joint investment of $10 million to fund and develop semiconductor curricula in colleges and universities across the country.
GOWIN Semiconductor Partners with Metrics for Simulator Tool
GOWIN Semiconductor Corp, the world’s fastest-growing programmable logic company, is partnering with Metrics Design Automation to introduce DSim Cloud as part of GOWIN’s FPGA EDA solution.
New Report Identifies Target Areas for CHIPS R&D Investments
SIA-BCG study calls for new federal funds to be directed at five key areas of semiconductor R&D.
Cadence’s New Flow Automates Custom/Analog Design Migration on TSMC Advanced Technologies
Cadence Design Systems, Inc.collaborated with TSMC to develop a node-to-node design migration flow built upon the Cadence Virtuoso design platform for custom/analog IC blocks that use TSMC’s advanced process technologies.
Synopsys Collaborates with TSMC
Addressing complex customer requirements for heterogeneous compute-intensive applications, Synopsys, Inc. today announced the availability of the industry’s most comprehensive EDA and IP solutions for 2D/2.5D/3D multi-die systems for TSMC’s most advanced N7, N5 and N3 process technologies.
Alchip Technologies Joins UCIe Consortium
Alchip Technologies has joined the UCIe (Universal Chiplet Interconnect Express) Consortium at the contributor level, reinforcing its position as the high-performance ASIC leader.
Worldwide Silicon Wafer Shipments Set a New Record in Q3 2022, SEMI Reports
Worldwide silicon wafer shipments reached a new record of 3,741 million square inches (MSI) in the third quarter of 2022, increasing 1.0% quarter-over-quarter and growing 2.5% from the 3,649 MSI recorded during the same quarter last year.
