Tower Semiconductor, a foundry of high value analog semiconductor solutions, and Teramount today announced a collaboration based on Teramount’s ‘PhotonicPlug’ technology and Tower’s silicon photonic ‘Bump-ready’ wafers.‘
Packaging
POET Technologies and Vanguard Automation Collaborate on Solutions for Co-packaged Optics and AI-ML Applications
POET Technologies Inc. and Vanguard Automation GmbH today announced a collaboration to enable the integration of Micro-Lenses on the POET Optical Interposer to maximize coupling efficiency while maintaining POET’s wafer-level passive assembly process.
Sivers Semiconductors Joins the Northeastern Microelectronics Coalition
Sivers Wireless and more than 85 organizations from across the Northeast region of the United States have submitted a proposal to the US federal government to create the Northeast Microelectronics Coalition.
AmberSemi Announces Successful Tapeout of Silicon Chip for Patented AC Direct DC Power Delivery Technology
This technology represents a massive global opportunity to revolutionize the way power is delivered to every electrical endpoint on earth.
Draper Opens New Office in Indiana
The office in WestGate@Crane Technology Park will support Microelectronics R&D, strategic programs for the Defense Department and the Naval Surface Warfare Center, Crane Division.
JEDEC Creates New Automotive Steering Subcommittee
JEDEC Solid State Technology Association announces the formation of the JC-42.9 Automotive Steering Subcommittee responsible for investigating memory technologies and recommending solutions pertaining to automotive applications.
SRC Publishes Interim Microelectronics and Advanced Packaging Technologies Roadmap, Seeks Public Comments
Semiconductor Research Corporation (SRC), a world-renowned semiconductor research and workforce development consortium, released an interim report for the Microelectronic and Advanced Packaging Technologies (MAPT) Roadmap.
StratEdge to Display Molded Ceramic Semiconductor Packages at the IMAPS Device Packaging, APEC, and GOMACTech Conferences
StratEdge Corporation will display its molded ceramic packages at the IMAPS Device Packaging, APEC, and GOMACTech conferences, all of which are being held in March.
Magnachip Unveils Super-Short Channel MXT MOSFETs for Smartphone Battery Protection Circuit Modules
Magnachip Semiconductor Corporation announced today that the company has released two seventh-generation MXT MOSFETs.
JCET Provides Multiple Customers with Advanced Packaging HVM Solutions for 4D Millimeter-wave Radar
JCET Group recently announced the company provides multiple customers with advanced packaging HVM solutions for 4D millimeter-wave Radar, to meet the increasingly diversified and customized demands of automotive electronic applications.
