Applied Materials, Inc. today announced the commercial availability of “cold field emission” (CFE) technology, a breakthough in eBeam imaging that enables customers to better detect and image nanometer-scale, buried defects to speed the development and production of next-generation Gate-All-Around (GAA) logic chips as well as higher-density DRAM and 3D NAND memories.
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SEMICON Japan 2022 Opens Tomorrow to Showcase Cutting-Edge Technologies Powering Semiconductor Industry Growth
Opening keynote panel to feature Rapidus representatives discussing strategies for strengthening Japan’s semiconductor industry.
Syntiant Named 2022’s ‘Start-Up to Watch’ by the Global Semiconductor Alliance
Syntiant Corp., a provider of deep learning solutions for always-on edge AI voice, sensor and vision applications, today announced that the company was named 2022’s “Start-Up to Watch” during this year’s Global Semiconductor Alliance (GSA) Awards.
Toshiba Develops SiC MOSFET with Embedded Schottky Barrier Diode that Delivers Low On-Resistance and High Reliability
Toshiba Electronic Devices & Storage Corporation and Toshiba Corporation have developed an SiC metal oxide semiconductor field effect transistor (MOSFET) that arranges embedded Schottky barrier diodes (SBD) in a check pattern (check-pattern embedded SBD) to realize both low on-resistance and high reliability
ROHM Delivers the Industry’s Highest Rated Power Shunt Resistors in the 0508 Size
ROHM Semiconductor today announced they have developed the LTR10L series of wide terminal shunt resistors, optimized for a variety of applications in the automotive, industrial, and consumer sectors.
Congratulations to the 2022 Recipients of GSA’s Prestigious Annual Awards
Last night, the Global Semiconductor Alliance (GSA) celebrated the achievements of remarkable individuals and exceptional semiconductor companies at its annual GSA Awards Ceremony gala.
KLA Launches Revolutionary X-Ray Metrology System
Today, KLA Corporation (NASDAQ: KLAC) announced the launch of the revolutionary Axion T2000 X-ray metrology system for advanced memory chip manufacturers.
CEA-Leti Shares the Path Towards Full Fault-Tolerant Quantum Computing In Plenary Talk at IEDM 2022
CEA-Leti presented three papers at IEDM 2022 detailing its recent advances and future challenges in quantum computing using Si-based qubit devices with FDSOI technologies.
Major Silicon Carbide Semiconductor Supplier Chooses Aehr for Production Wafer Level Test and Burn-in
Aehr Test Systems (NASDAQ: AEHR), a worldwide supplier of semiconductor production test and reliability qualification equipment, today announced it has received an initial production order from its new major silicon carbide semiconductor supplier customer for a FOX-XP multi-wafer test and burn-in system configured with Aehr’s new fully integrated and automated WaferPak Aligner.
CEA-Leti Presents RRAM’s ‘Promising Advantages’ For Neuromorphic/In-Memory Computing at IEDM 2022
A CEA-Leti tutorial presented at IEDM 2022 highlighted promising advantages that resistive random-access memory (RRAM) technologies hold for implementing novel neuromorphic/in-memory computing systems for massively parallel, low-power and low-latency computation.
