Packaging

Micron Delivers the World’s Most Advanced Client SSD Featuring 232-Layer NAND Technology

Micron Technology, Inc. today announced it is shipping the Micron 2550 NVMe SSD to global PC OEM customers for use in mainstream laptops and desktops.

Transphorm Expands Footprint with GaN Application Lab in China

Transphorm, Inc. announced it has opened a new office in Shenzhen, China.

TechInsights Acquires IC Knowledge LLC in a Further Expansion of Its Platform of Semiconductor Market Analysis Content

TechInsights Inc. announced the acquisition of IC Knowledge LLC, the world leader in cost modeling of semiconductors.

NextFlex Announces Over $8 Million in Funding for Flexible Hybrid Electronics Innovations in Advanced Semiconductor Packaging and Environmental Sustainability

NextFlex, America’s Flexible Hybrid Electronics (FHE) Manufacturing Institute, today announced $8.45 million in funding (including $4.25M in cost-share contribution from participants) for nine new projects as part of its Project Call 7.0 to further promote FHE development and adoption throughout the U.S. advanced manufacturing sector.

ROHM and BASiC Semiconductor Form a Strategic Partnership

Contributing to the technical innovation of new energy vehicles through the development of automotive SiC power devices.

Dr. Nissan Cohen, Ex-Founder/CEO of Tower Semiconductor, Joins Nano Dimension’s Board of Directors

Dr. Yoav Nissan-Cohen will replace Mr. Yaron Eitan, who has served on the board of Nano Dimension since March 2020 and has stepped down as Dr. Nissan-Cohen joined.

SEMI Commends European Council’s Progress on Chips Act, Urges Swift Start of Trialogue Negotiations

SEMI, the industry association serving the global electronics design and manufacturing supply chain, today applauded the progress on the European Chips Act by the European Council, expressing strong support for the swift start of the negotiations in 2023.

Lattice Semiconductor Appoints Douglas Bettinger to Board of Directors

Lattice Semiconductor, the low power programmable leader, today announced the appointment of Douglas Bettinger to the Company’s Board of Directors and Audit Committee effective December 2, 2022.

The MOSIS Service of the USC Information Sciences Institute and SkyWater Collaborate on Silicon IC Design Enablement and Manufacturing Service

The MOSIS Service will provide multi-project wafer (MPW) shuttle access to SkyWater’s S90 and S130 mixed-signal CMOS technologies. 

Global Semiconductor Equipment Billings Increase 9% in Q3 2022, SEMI Reports

Global semiconductor equipment billings rose 9% from the second to the third quarter of 2022 and 7% year-over-year to US$28.75 billion, SEMI announced today.

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