STMicroelectronics and Soitec announce the next stage of their cooperation on Silicon Carbide (SiC) substrates, with the qualification of Soitec’s SiC substrate technology by ST planned over the next 18 months.
Packaging
What’s in the November/December Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the November/December issue.
Making Sense of Coercivity in Magnetic Materials with Machine Learning
Scientists develop a meaningful approach to analyze how a material’s microstructure relates to its macroscopic physical properties.
High Purity T-342 Diaphragm Valve Now Includes Sanitary Adapters Option
Asahi/America, Inc. now offers its T-342 diaphragm valves with optional sanitary adapter end connectors.
Henkel Non-Conductive Die Attach Film Offers Broad Wirebond Package Flexibility
Henkel today announced the commercialization of a high-performance non-conductive die attach film (ncDAF) engineered to address the demands of contemporary packaging device designs.
CVD Deposition, Plating and Sputter Target Materials Looking Strong Despite Threat of Semiconductor Market Slowdown
Advanced packaging and interconnect layers driving growth through ‘26.
After Record Sales in 2022, Semi Sales Forecast to Fall -5% in 2023
Collapsing memory prices and uncertain global economy weigh on next year’s growth.
Silicon Labs CEO Matt Johnson Elected Chair of Semiconductor Industry Association
Texas Instruments CEO Rich Templeton elected SIA Vice Chair.
Pfeiffer Vacuum Welcomes this Year’s Röntgen Prize Winner Dr. Victoria Grinberg
This year, the prestigious Röntgen Prize was awarded by the Justus Liebig University Giessen (JLU) to the astrophysicist and science advocate for her groundbreaking research in X-ray astronomy.
Why Is ASU a Major Player in Microelectronics?
University experts share insights on the technology driving our world.
