Winbond has joined the UCIe (Universal Chiplet Interconnect Express) Consortium, the industry Consortium dedicated to advancing UCIe technology.
Packaging
SEMI Europe Honors Melexis, Warsaw University of Technology and Centera Labs Leaders for Contributions to Semiconductor Industry
SEMI Europe today announced recipients of the European SEMI Award and Special Service Award for 2022 at the SEMI Industry Strategy Symposium Europe (ISS Europe 2023).
JEDEC Wide Bandgap Power Semiconductor Committee Publishes a Series of Documents for Reliability and Testing of Silicon Carbide (SiC) MOSFETs
The publications were developed by JEDEC’s JC-70.2 Silicon Carbide Subcommittee and are available for free download from the JEDEC website.
Silicon Motion Launches Third Generation PCIe Gen4 SSD Controller for Future TLC and QLC 3D NAND Flash
Silicon Motion Technology Corporationtoday announced the SM2268XT, its latest high-performance PCIe Gen4 SSD controller solution optimized for higher speed NAND transfer rates.
Arctic Semiconductor Ships Its First 5G RF Chipset, IceWings, for the 5G Market
Arctic Semiconductor today announced it has rebranded from SiTune Corporation to Arctic Semiconductor, to emphasize its focus on 5G RF products.
Telink Semiconductor Helps HooRii Technology Achieve Matter Certification for Its Smart Plug Product
Telink Semiconductor Co. today announced that it has helped HooRii Technology acquire Matter certification for its smart plug product.
Intelligent High-Side Switch from Diodes Incorporated Enables Assured Automotive System Reliability
Diodes Incorporated has introduced the DIODES ZXMS81045SPQ, its first protected, automotive-compliant, high-side IntelliFET.
Adeia and Qorvo Enter into Hybrid Bonding License Agreement
Adeia Inc., the company whose patented innovations enhance billions of devices, today announced that Qorvo, a global provider of connectivity and power solutions, has licensed Adeia’s hybrid bonding technology.
SIA Urges Full Funding of CHIPS & Science Act Research Programs in President’s FY24 Budget
Semiconductor Industry Association (SIA) President and CEO John Neuffer today sent a letter to Office of Management and Budget Director Shalanda Young, encouraging her to include in the President’s Budget Request for Fiscal Year 2024 (FY24) full funding for research and workforce programs authorized by the CHIPS and Science Act of 2022.
