Analog Devices, Inc. and Keysight Technologies, Inc. today announced their collaboration to advance the adoption of phased array technology.
Packaging
Achronix Appoints Mahesh Karanth as CFO
Achronix Semiconductor Corporation announced it has named semiconductor industry veteran, Mahesh Karanth, as its chief financial officer.
Advanced Semiconductor Packaging Technologies in Data Centers: The Growth Drivers and the Cutting-Edge Use Cases
Growth drivers of advanced semiconductor packaging technologies on data center applications, as well as give several examples of cutting-edge commercial server products that adopt advanced semiconductor packaging technologies.
U.S. Government to Fund Expansion of IP Ecosystem for SkyWater’s 90nm Rad-Hard Platform
SkyWater Technology today announced the Department of Defense (DOD) is investing $12 million to expand the intellectual property (IP) ecosystem for the company’s 90nm radiation-hardened (rad-hard) by process offering, as part of the previously announced $27 million investment.
What’s in the October Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the October issue. If you are attending SEMICON Europa stop by the publication bins and pick up a copy in print!
Lockheed Martin, Ayar Labs Partner to Advance Microchip Connectivity for Next Generation Sensory Systems
Lockheed Martin, (NYSE: LMT) and Ayar Labstoday announced a strategic collaboration to develop future sensory platforms that leverage Ayar Labs’ advanced optical I/O microchips that use light to transfer data faster, at a lower latency, and at a fraction of the power of existing electrical I/O solutions.
Global 300mm Semiconductor Fab Capacity Projected To Reach New High in 2025, SEMI Reports
Strong demand for automotive semiconductors and new government funding and incentive programs in multiple regions are driving much of the growth.
Pfeiffer Vacuum Components & Solutions Celebrates 25th Anniversary
This year, Pfeiffer Vacuum Components & Solutions GmbH in Göttingen is celebrating its 25th anniversary.
CHIPS Act Implementation Requires Strong Focus on “Advanced Packaging,” Industry Leaders Say
Ever-more complex packaging of chips will be the key driver of future innovation, yet the United States and Europe are behind the curve.
Aehr Announces New Advanced Testing Capabilities on its FOX-P Wafer Level Test & Burn-in Systems
Aehr Test Systems (NASDAQ: AEHR), a worldwide supplier of semiconductor test and reliability qualification equipment, today announced it has released two new enhancements for its FOX-P family of wafer level test and burn-in systems.
