This week, at an exclusive gathering in Detroit (MI), bringing together the global automotive ecosystem to discuss the evolution towards chiplets in cars (Automotive Chiplet Forum 2024), imec announced that Arm, ASE, BMW Group, Bosch, Cadence Design Systems, Inc., Siemens, SiliconAuto, Synopsys, Tenstorrent and Valeo are the first that have committed to join its Automotive Chiplet Program (ACP).
Packaging
What’s in the October Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the October issue.
Lantronix Announces Five New System-in-Package Solutions Powered by Qualcomm
Lantronix Inc. today announced its powerful new System-in-Package (SiP) solutions powered by Qualcomm Technologies’ chipsets that reinforce Lantronix’s position in industrial and enterprise IoT innovation, bringing advanced Artificial Intelligence (AI) and Machine Learning (ML) capabilities to the edge.
Infineon and AWL-Electricity Partner to Improve Wireless Power with GaN Power Semiconductors
Infineon Technologies AG today announced a partnership with Canada-based AWL-Electricity Inc., a pioneer in MHz resonant capacitive coupling power transfer technology.
Keysight Unveils 3kV High Voltage Wafer Test System for Power Semiconductors
Increased productivity and efficiency with one-pass test enabled by a high-voltage switching matrix.
ROHM’s New PWM Controller ICs with SOP Package for Power Supplies in a Wide Variety of Industrial Applications
ROHM Semiconductor today announced new external FET-type controller ICs utilizing PWM current control mode optimized for AC-DC power supplies in various industrial applications.
Quantum Register Reaches 1200 Neutral Atoms in Continuous Operation
A Munich Quantum Valley (MQV) research team, led by the Max Planck Institute of Quantum Optics (MPQ) in collaboration with the quantum computing start-up planqc, has succeeded in running a register of 1200 atoms continuously for over an hour – a breakthrough on the way to scalable quantum computers.
2024 IEEE IEDM Spotlights Advances in Critical Semiconductor Technologies
Since it began in 1955, the IEEE International Electron Devices Meeting (IEDM) has been where the world’s best and brightest electronics technologists go to learn about the latest breakthroughs in semiconductor and related technologies.
Terecircuits Unveils New Bonding Material for Next-Generation Advanced Packaging
Terecircuits Corporation, a venture-backed startup in advanced materials for the semiconductor industry, today introduced Terefilm, a patented material designed for temporary bonding and debonding applications in advanced packaging.
Northeast Microelectronics Coalition Hub Awards More Than $1 Million to Advance Microelectronic Innovation
First-of-its-kind program awards startups and small businesses with funding to develop next-gen microelectronics technologies.
