Tata Group, a global enterprise headquartered in India, and Analog Devices, Inc. today announced a strategic alliance to explore potential cooperative manufacturing opportunities.
Packaging
Student Analog Chip Designs Come to Life Through New Collaboration with Texas Instruments
The Georgia Tech School of Electrical and Computer Engineering (ECE) is collaborating with Texas Instruments (TI) to launch strategic educational opportunities aimed at providing students access to industry-grade analog chip design, fabrication, and testing processes.
Intel and AWS Expand Strategic Collaboration
Intel Corp. and Amazon Web Services. Inc., an Amazon.com company, today announced a co-investment in custom chip designs under a multi-year, multi-billion-dollar framework covering product and wafers from Intel.
Purdue Deep-Learning Innovation Secures Semiconductors Against Counterfeit Chips
RAPTOR technology exceeds the performance of traditional tampering detection methods by up to 40%.
Arm Announces Appointment of Young Sohn to its Board of Directors
Arm today announced the appointment of new Board member Young Sohn.
SkyWater Names Bassel Haddad as Sr. Vice President and General Manager of Advanced Packaging
SkyWater Technology today announced the appointment of Bassel Haddad as senior vice president and general manager of advanced packaging.
Intel Awarded up to $3B by the Biden-Harris Administration for Secure Enclave
The Biden-Harris Administration announced today that Intel Corporation has been awarded up to $3 billion in direct funding under the CHIPS and Science Act for the Secure Enclave program.
NHanced Semiconductors President Robert Patti to Deliver Keynote at IEEE 3DIC Conference in Sendai, Japan
At the upcoming IEEE International 3D Systems Integration Conference (3DIC), NHanced Semiconductors president Robert Patti will deliver a keynote address detailing the critical role of advanced packaging in continuing the progress of Moore’s Law in semiconductor development.
Samsung Begins Industry’s First Mass Production of QLC 9th-Gen V-NAND for AI Era
Samsung Electronics today announced it has begun mass production of its one-terabit (Tb) quad-level cell (QLC) 9th-generation vertical NAND (V-NAND).
PPG Launches PPG STEELGUARD 951 Fire Protection Coating in the Americas
PPG today announced the launch of PPG STEELGUARD 951 epoxy intumescent fire protection coating in the Americas.
