Samsung Electronics Co., Ltd. today showcased a series of cutting-edge semiconductor solutions set to drive digital transformation through the decade, at Samsung Tech Day 2022.
Packaging
Power Transistor Sales and ASP Will Both Increase 11% in 2022
Tight supplies, device shortages are driving up the average selling price of power transistors by the highest percentage since 2010, says update report.
Bosch Rexroth Announces Expansion in Factory Automation Capabilities
Bosch Rexroth is planning to expand its operations and will move its linear and assembly technology manufacturing facility to a new location in Charlotte, the company announced today.
Advantest Announces Call for Papers for VOICE 2023 Developer Conference in Santa Clara, California
Semiconductor test equipment supplier Advantest Corporation has issued an international call for papers for its VOICE 2023 Developer Conference focusing on leading-edge technologies and future trends.
Promex Expands Die Bonding Capacity, Adds New Capabilities
Promex Industries, a Silicon Valley-based provider of advanced design, packaging and microelectronics assembly services, today announced it has completed the first phase of its plan to expand its die bonding services.
Synopsys and Samsung Foundry Enable 3nm Process Technology for Power- and Performance-Demanding Mobile, HPC and AI Designs
Synopsys, Inc. today announced that its longstanding collaboration with Samsung Foundry has produced multiple successful test chip tapeouts on Synopsys digital and custom design tools and flows, certified for Samsung Foundry’s most advanced process.
SEMIFIVE Announces New 5nm HPC SoC Platform
SEMIFIVE, a design solution provider and pioneer of platform-based custom silicon solutions, today revealed its latest SoC Platform targeting high performance compute (HPC) applications.
Mark Templeton Inducted into Phil Kaufman Hall of Fame by the ESD Alliance and IEEE CEDA
Mark Templeton, the former managing director of investment firm Scientific Ventures, and a Lanza techVentures investment partner and board member, today was inducted posthumously into the Phil Kaufman Hall of Fame.
KLA Announces Plans to Build a New R&D and Manufacturing Facility in Newport, Wales
KLA Corporation has announced plans to build a new research-and-development (R&D) and manufacturing center for the SPTS division, in Newport, Wales, UK.
Industry Well Represented on New U.S. Government Advisory Committee on Microelectronics Industry
Two of the electronics industry’s most far-sighted and innovative leaders have been named to the U.S. Department of Commerce’s new Industrial Advisory Committee (IAC), which will provide guidance to the Secretary of Commerce on a range of issues related to CHIPS for America Act programs.
