Solidigm, a U.S.-based leading global provider of innovative NAND flash memory solutions, has named the City of Rancho Cordova in Greater Sacramento the company’s new global headquarters.
Packaging
Global Semiconductor Sales Increase 3.2% in 2022 Despite Second-Half Slowdown
Worldwide industry sales totaled a record $573.5 billion in 2022, but sales slowed significantly during second half of year.
Aldec Releases Automated Static Linting and CDC Analysis for Microchip FPGA and SoC FPGA Designs
Aldec, Inc. has updated its popular linting tool ALINT-PRO to enhance the support of Microchip Technology’s Libero SoC Design Suite.
Singapore’s Capcon Raises Around $50 Million
Capcon, a Singapore-based advanced packaging solution provider, has secured around $50 million in series B2 funding.
8th Annual CMC Conference in Round Rock, Texas
Join chip fabricators and suppliers in discussing current trends and issues for the semiconductor materials supply chain.
Saras Micro Devices Set to Expand in Atlanta with New Inland Tract Office
Saras Micro Devices has selected the Inland Tract property located in West Midtown as it prepares to expand its Atlanta research and development operations.
Intel and UC San Diego Join DARPA Program to Prevent Exploitation of Computing Systems
Intel and the University of California, San Diego have been selected for the DARPA Hardening Development Toolchains Against Emergent Execution Engines program.
Axcelis President and CEO Mary Puma Named International Board Chairperson of SEMI Industry Association
Puma will lead the SEMI International Board of Directors in evolving the association’s operations, programs and services worldwide to support the growth of member companies throughout the supply chain.
Littelfuse Acquires Western Automation Research and Development
Littelfuse, Inc. today announced it has acquired Western Automation Research and Development Limited.
Alchip Technologies Announces 3DFabric Alliance Support Plans
Alchip Technologies is putting teeth into its role as a founding member of TSMC’s 3DFabric Alliance by enhancing its 3nm process technology and advanced packaging capabilities.
