In a newly-published study, a team of researchers in Oxford University’s Department of Materials led by Harish Bhaskaran, Professor of Applied Nanomaterials, describe a breakthrough approach to pick up single nanowires from the growth substrate and place them on virtually any platform with sub-micron accuracy.
Packaging
NAND Flash Prices Expected to Plummet 15-20% in Q4
Utmel, a professional electronic component distributor, informs buyers that NAND flash prices are expected to fall 15-20% in Q4.
Saras Micro Devices Selects Technology Manufacturing Site in Arizona
Saras Micro Devices has selected a site in the Price Corridor in Chandler, AZ to build out a manufacturing facility for its advanced power delivery solutions.
StratEdge Packaging and Assembly Services Expands for High-Frequency and High-Power Devices
Technical experts available at BCICTS 2022 and IMAPS 2022 to discuss packaging applications.
onsemi Launches Automotive Silicon Carbide-Based Power Module Trio for On-Board Chargers
onsemi today announced a trio of silicon carbide (SiC) based power modules in transfer molded technology that are intended for use in on-board charging and high voltage (HV) DCDC conversion within all types of electric vehicles (xEV).
ACM Research Launches New Furnace Tool for Thermal Atomic Layer Deposition to Support Advanced Semiconductor Manufacturing Requirements
ACM Research, Inc., a supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today announced that it has expanded its 300mm Ultra Fn furnace dry processing platform with the introduction of its Ultra Fn A furnace tool.
Nearly $11M in Addtional DOD Funds Expands Purdue-led Microelectronics Workforce Program
Five-year extension of SCALE workforce initiative aims to restore global lead through education initiatives.
Global Fab Equipment Spending Forecast to Reach All-Time High of Nearly $100 Billion in 2022
Global fab equipment spending for front-end facilities is expected to increase approximately 9% year-over-year (YOY) to a new all-time high of US$99 billion in 2022.
SEMI and AVCC Team to Promote Autonomous Vehicle Innovation and Mass Market Adoption
The Autonomous Vehicle Computing Consortium and SEMI announced today an alliance to drive autonomous vehicle innovation.
New Nanocomposite Films Boost Heat Dissipation in Thin Electronics
Scientists from Japan developed cellulose nanofiber-carbon fiber composite films with high in-plane heat conductivity to assist in heat dissipation.
