Ayar Labs has expanded its executive team to further commercial development, with the addition of Lakshmikant (LK) Bhupathi, Vice President of Products, Strategy and Ecosystem, and Scott Clark, Vice President of Manufacturing and Operations.
Packaging
Electrically Conductive Adhesive from Henkel Designed to Accommodate Compact Camera Module Complexity
Henkel continues to lead in consumer electronic material solutions and today announced its latest innovation, an electrically conductive adhesive (ECA) that cures at room temperature, improving yield rates and protecting sensitive structures within mobile device compact camera modules (CCMs).
Tektronix Partners with BRIDG to Boost Domestic Semiconductor Package Testing
This collaboration will expand advanced semiconductor package testing capabilities in the US.
Provider of Diamond Semiconductor Wafers, DIAMFAB, Unveils New Strategy and Technology Vision
DIAMFAB, a start-up innovator of high value-added diamond semiconductor wafer technology for next-generation electronics, today announced that the company will move to a new dual business model strategy.
GSA Announces 2022 Award Nominees
The prestigious awards will be presented at GSA’s Awards Celebration on Thursday, Dec. 8, 2022.
Global Silicon Wafer Shipments Projected to Set New Record in 2022, SEMI Reports
Global silicon wafer shipments are projected to increase 4.8% year-over-year in 2022 to a record high of nearly 14,700 millions of square inches (MSI), SEMI reported today in its annual silicon shipment forecast for the semiconductor industry.
EV Group Advances Leadership in Optical Lithography with Next-Generation EVG150 Resist Processing Platform
Redesigned 200mm platform increases module capacity for higher throughput, improves architecture for reduced tool footprint all while maintaining industry-leading capabilities of previous-generation platform.
SEMICON Europa 2022 Keynotes to Highlight Chip Industry Growth Opportunities and Advanced Technologies
Registration for the event, co-located with electronica, is now open.
Semiconductor Climate Consortium Representatives to Present During 2022 United Nations Climate Change Conference (COP27)
SEMI today announced that members of the new Semiconductor Climate Consortium (SCC) will discuss key aspects of the group’s vision, goals and membership at two sessions during COP27 in Sharm El-Sheik, Egypt.
Samsung Electronics Begins Mass Production of 8th-Gen Vertical NAND with Industry’s Highest Bit Density
Samsung Electronics Co., Ltd., as promised at Flash Memory Summit 2022 and Samsung Memory Tech Day 2022, announced today that it has begun mass producing a 1-terabit (Tb) triple-level cell (TLC) eighth-generation Vertical NAND (V-NAND) with the industry’s highest bit density.
