IR laser cleave technology enables nanometer-precision layer transfer through silicon, eliminating glass substrates for advanced packaging and enabling thin-layer 3D stacking
Packaging
Memory Market Collapse to Lift TSMC to Top Spot in 3Q22 Ranking
Plunge in memory market to drop Samsung to second place; Intel expected to fall to third.
StratEdge Offers Assembly Services for Die Attachment on CMC Tabs
Experts available at BCICTS 2022 and IMAPS 2022 to analyze your high-frequency packaging needs.
Renesas Unveils New-Generation Si IGBTs for Electric Vehicle Inverters
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, announced the development of a new generation of Si-IGBTs (Silicon Insulated Gate Bipolar Transistors) which will be offered in a small footprint while providing low power losses.
Palomar Technologies Appoints New Managing Director for its European Operations
Palomar Technologies announced the appointment of Mr. Thorsten Scheidler as the new managing director for its European operations effective October 1, 2022.
Global Semiconductor Equipment Billings Increase 7% in Q2 2022, SEMI Reports
Global semiconductor equipment billings rose 7% from the first to the second quarter of 2022 and 6% year-over-year to US$26.43 billion, SEMI announced today in its Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report.
SkyWater to Expand its Advanced Packaging Facility Operations in Florida
Grant is part of $50.8M award from the Economic Development Administration’s Build Back Better Regional Challenge to grow Osceola County’s NeoCity as an innovation center for semiconductor research, design and manufacturing.
Global Semiconductor Sales Increase 7.3% Year-to-Year in July, but Growth Slows
Worldwide sales in July decrease 2.3% on a month-to-month basis.
IMAPS to Host Workshop
The International Microelectronics Assembly and Packaging Society (IMAPS) will host a one-day Workshop to discuss and promote strategies to improve on-shore packaging and assembly capabilities on October 3, 2022, at the Hynes Convention Center, Boston, Massachusetts.
Smart Mobility, Despite Challenges, to Drive Industry’s Growth
Dogged by controversy, smart mobility faces technical, regulatory challenges, experts said at a Smart Mobility panel at 2022 SEMICON West.
