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onsemi and VW Group Cement Strategic Collaboration on Silicon Carbide Technology

The two companies are developing a complete traction inverter solution for the OEM’s modular car platform for electric vehicles (EVs).

CEA-Leti Will Highlight Progress on Key Augmented Reality Building Blocks, Including Retinal Projection and Holography

Reflecting CEA-Leti’s steady pursuit of developing silicon photonics and integrated optics for augmented reality (AR) glasses, the institute will update its progress on a variety of key technological building blocks such as retinal projection and holography via 15 papers and poster presentations at Photonics West 2023 in San Francisco, Jan. 28-Feb. 2.

SEMI ISS Europe 2023 to Spotlight European Chips Act, Semiconductor Supply Chain Resilience and Growth

The European Chips Act and Europe’s leading-edge R&D capabilities – both key drivers of Europe’s microelectronics growth – will come into sharp focus at SEMI Industry Strategy Symposium Europe (ISS Europe) 2023.

ClassOne Appoints Semiconductor Industry Veteran John Voltz Senior Vice President of Global Business Operations

ClassOne Technology, a global provider of high-performance semiconductor wet processing tools, today announced that John Voltz has been appointed senior vice president, global business operations.

SEMICON West Makes Two Big Moves – Shifts to October in 2024, Begins Annual Rotation With Phoenix in 2025

A fixture in the San Francisco Bay Area for more than 50 years, SEMICON West is moving to Phoenix for a five-year annual rotation starting in 2025 and shifting from its longstanding July event dates to October beginning in 2024, SEMI announced today.

Quad-C Management to Acquire QED Technologies from Entegris

The transaction is expected to close in the first quarter of 2023, subject to receipt of required regulatory approvals and other customary closing conditions.

POET Technologies Announces a Strategic Collaboration with ADVA for Highly Integrated 4x100G Solutions

ADVA will use POET’s multi-engine transmit and receive chips in an innovative pluggable solution that packs the functionality of four independent 100Gbit/s interfaces into a single QSFP-DD housing.

Silanna UV Introduces TO-Can Package Format for 235nm and 255nm UV-C LEDs

Silanna UV announced the release of two new products in its SF1 235nm and SN3 255nm series of UV-C LEDs: the SF1-3T9B5L1 and the SN3-5T9B5L1.

proteanTecs to Showcase Interconnect Reliability Monitoring at the Chiplet Summit

proteanTecs announced today that the company will exhibit and present at the first annual Chiplet Summit.

Vertical Electrochemical Transistor Pushes Wearable Electronics Forward

Biomedical sensing is one application of efficient, low-cost transistors.

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