The 19th Annual Device Packaging Conference (DPC 2023) will be held March 13-16, 2023, at the WeKoPa Resort and Conference Center in Fountain Hills, Arizona.
Packaging
Global Semiconductor Sales Decrease 2.9% Month-to-Month in November
Worldwide chip sales down 9.2% year-to-year.
Chiplet Summit Promotes Higher Design Productivity at Leading-Edge Nodes
Chiplet Summit, to be held January 24-26 at the Doubletree by Hilton San Jose Hotel, will help designers go-to-market faster by using the latest design architecture – chiplets.
Kandi Technologies Announces CEO Transition
Kandi Technologies Group, Inc. today announced the appointment of Dr. Xueqin Dong as Chief Executive Officer, effective January 10, 2023.
IDTechEx Discusses What to Expect From the Graphene Industry in 2023
Is this the year of rapid graphene sales? Are we slipping deeper into a disillusionment phase? Who will emerge as the market leaders? Is consolidation inevitable? 2023 will be a telling year for the industry.
Samsung Electronics Unveils High-Performance PC SSD
Built with a market-leading 5nm controller and seventh-generation V-NAND, the PM9C1a will enable a new level of everyday PC efficiency, while also handling demanding computing and gaming tasks.
ROHM’s Fourth Generation SiC MOSFETs to be Used in Hitachi Astemo’s Inverters for Electric Vehicles
Contributing to longer cruising range and smaller systems in electric vehicles both in Japan and overseas from 2025.
Micron DDR5 Delivers Increased Performance and Reliability for the 4th Gen Intel Xeon Scalable Processor Family
Micron Technology, Inc. today announced that its DDR5 server memory portfolio for the data center is now fully validated on the 4th Gen Intel Xeon Scalable processor family.
POET Technologies Announces Production Release of Optical Engines for 100G, 200G and 400G for Telecom and Data Center Market
Achievement marks commercialization milestone for products built with proprietary wafer-level chip-scale packaging technology.
Slowing Industry Conditions Temporarily Eases Supply Strain in 2023 for Silicon and SOI Wafers
Investments in increased capacity not expected to alleviate strain until 2024-2025.
