Ferrotec Holdings Corporation today announced the groundbreaking ceremony to begin construction of its new manufacturing facility at Kulim Hi-Tech Park, Kedah, facilitated by the Malaysian Investment Development Authority (MIDA).
Packaging
Applied Materials Chief Technology Officer Dr. Om Nalamasu Receives IEEE Frederik Philips Award
Applied Materials, Inc. today announced that Dr. Omkaram (Om) Nalamasu, Senior Vice President and Chief Technology Officer, is the recipient of the 2023 IEEE Frederik Philips Award, which honors outstanding accomplishments in the management of research and development resulting in effective innovation in the electrical and electronics industry.
Advanced Semiconductor Packaging Paves Way to Data-Centric Future, Says IDTechEx
IC vendors have been pushed towards “advanced semiconductor packaging” to meet the world’s data needs.
Mercury Systems Receives $12M Order for Advanced Packaging of GPS Modules
Mercury Systems Inc. announced it received a $12 million order from a leading defense prime contractor to provide advanced trusted and secure manufacturing and packaging for their GPS modules.
US CHIPS ACT Now Approved by President Biden – What’s Next?
Yesterday, President Biden signed the long-awaited CHIPs Act into law. So, “what’s next” for the US semiconductor industry? The electronic materials advisory firm TECHCET offers insight.
President Biden Signs CHIPS Act Into Law
The legislation provides a 25% tax credit for U.S. facilities that produce semiconductors or chipmaking equipment and $52 billion in funding for new semiconductor programs.
Akoustis Ships Second 5G Mobile Filter Design in its New Wafer-Level-Package to First Foundry Customer
Akoustis Technologies, Inc., an integrated device manufacturer (IDM) of patented bulk acoustic wave (BAW) high-band RF filters for mobile and other wireless applications, announced today that it has completed the second design iteration of a 5G mobile filter and shipped samples to its first XBAW mobile foundry customer.
Henkel and CITC Forge Partnership to Accelerate High-Thermal Die Attach Solutions
Henkel and Chip Integration Technology Center (CITC) announced today that the organizations have formalized an agreement to collaborate on the development of high-thermal die attach solutions for radio frequency (RF) and power electronics.
Micron Announces $40 Billion Investment in Leading-Edge Memory Manufacturing in the US
Largest ever investment in U.S. memory manufacturing will create an estimated 40,000 American jobs, strengthen national security and bolster supply chain resilience.
GlobalFoundries and Qualcomm Announce Extension of Long-term Agreement to Secure U.S. Supply through 2028
Today’s announcement secures wafer supply and commitments to support U.S.-based manufacturing through capacity expansion at GF’s most advanced semiconductor manufacturing facility, in Malta, New York.
