The acquisition enhances Nordson’s test and inspection platform, providing differentiated technology that expands Nordson’s product offering in the semiconductor and electronics industries.
Packaging
NEO Semiconductor Awarded “Best of Show” for Most Innovative Memory Technology
X-NAND Gen2 that enables 3D NAND flash memory with 20X faster write performance received top honors at Flash Memory Summit 2022.
Intel Orders Delayed, TSMC Slows Three-Nanometer Expansion, Says TrendForce
According to TrendForce research, Intel plans to outsource the tGPU chipset in Meteor Lake to TSMC for manufacture.
SkyWater Joins the American Semiconductor Innovation Coalition
Industry consortium proposes solutions for the National Semiconductor Technology Center and the National Advanced Packaging Manufacturing Program requested in the CHIPS+ Act.
IC Sales Turn Negative as Economy Weighs on Market
Never-before seen decline in June IC market driven by steep drop in memory pricing.
InnovationLab Demonstrates Breakthrough PCB Production Method Based on Additive Manufacturing
InnovationLab, the expert in printed electronics “from lab to fab”, announces it has achieved a breakthrough in additive manufacturing of printed circuit boards (PCBs), helping meet higher environmental standards for electronics production while also reducing costs.
US/China Tension Must Be Seen in the Context of Taiwan’s TSMC’s Critical Role in the Global Semi Supply Chain
Following the news of raising tension between the US and China as a result of US House Speaker Nancy Pelosi recent visit to Taiwan; Josep Bori, Research Director in the Thematic team at GlobalData, a leading data and analytics company, offers his view.
Lip-Bu Tan, Executive Chairman of Cadence Design Systems and Chairman of Walden International, to Receive Semiconductor Industry’s Top Honor
Tan, renowned tech visionary and venture capital pioneer, will accept 2022 Robert N. Noyce Award during SIA Awards Dinner on Nov. 17.
SK hynix Develops World’s Highest 238-Layer 4D NAND Flash
SK hynix Inc. announced today that it has developed the industry’s highest 238-layer NAND Flash product.
Kioxia Launches Second Generation of High-Performance, Cost-Effective XL-FLASH Storage Class Memory Solution
Kioxia Corporation today announced the launch of the second generation of XL-FLASH, a Storage Class Memory (SCM) solution based on its BiCS FLASH 3D flash memory technology, which significantly reduces bit cost while providing high performance and low latency.
