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Partstat Partners with Major Financial Group to Provide Enhanced Inventory Financing Options to Manufacturers Amid Global Chip Shortage

Partstat, a unique inventory ownership solution provider, recently entered into a partnership agreement with one of the world’s leading financial groups.

Order for a New Production MBE Machine in Asia

RIBER is announcing an order for a MBE 6000 production system in Asia for a total amount of several million euros.

Strategic Materials Conference 2022 to Spotlight Innovations Paving the Way to $1 Trillion Semiconductor Industry

With advanced materials a critical enabler of semiconductor growth applications, Strategic Materials Conference (SMC 2022) will gather top executives and leaders from every segment of semiconductor manufacturing for insights into the latest developments in advanced materials October 3-5, 2022 at the DoubleTree by Hilton in San Jose, Calif.

3M and Nordson Introduce a New Automated Bonding System

This end-to-end bonding solution combines all the benefits of 3M VHB Tapes with the versatility of a liquid adhesive in a single contained footprint enabling usage on any scale.

JCET Begins Construction of a New High-End Manufacturing Base in Jiangyin

The “JCET Microelectronics Wafer-level Microsystems Integration High-end Manufacturing Project,” officially started construction of JCET’s new plant in Jiangyin City of Jiangsu province.

Industry Reacts to Passage of CHIPS and Science Act of 2022

Semiconductor companies around the globe issued statements on Thursday following the passage of legislation of the CHIPS and Science Act of 2022 in the U.S. House of Representatives aimed at increasing American semiconductor manufacturing.

Flexible Hybrid Capacitors Based on Transition Metal Composite Electrode

The shortage of fossil energy sources lead to high requirements for the exploration of sustainable energy conversion and storage equipment. Supercapacitor (SC) is a kind of excellent energy storage device due to the high power density and long cycle life. However, the low energy density restricts their further practical application. Therefore, it is extremely important to develop high-performance electrode materials with excellent performances.

NEO Semiconductor Launches Second-Generation X-NAND Flash Memory Architecture

NEO Semiconductor, a developer of innovative architectures for NAND flash and DRAM memory, today announced the release of its second-generation X-NAND architecture.

Finwave Semiconductor Raises $12.2M Series A Funding Round to Advance the Ultimate Transistor for 5G

3DGaN (Gallium Nitride) innovators Finwave Semiconductor, Inc.ctor, Inc. today announced a $12.2 million Series A funding round led by Fine Structure Ventures with additional participation from Citta Capital, Soitec, Safar Partners and Alumni Ventures.

Improving Image Sensors for Machine Vision

On-chip spectrometer, silicon nanowires determine light spectrum, angle.

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