Advanced Energy Industries, Inc. today announced the launch of its 2025 – 2026 Advanced Energy STEM Scholarship Program.
Packaging
Sony Semiconductor Solutions to Release CMOS Image Sensor for Automotive Cameras
Sony Semiconductor Solutions Corporation (SSS) today announced the upcoming release of the ISX038 CMOS image sensor for automotive cameras, the industry’s first product that can simultaneously process and output RAW and YUV images.
Amkor and TSMC to Expand Partnership and Collaborate on Advanced Packaging in Arizona
Amkor Technology, Inc. and TSMC announced today that the two companies have signed a memorandum of understanding to collaborate and bring advanced packaging and test capabilities to Arizona, further expanding the region’s semiconductor ecosystem.
OMNIVISION Expands TheiaCel Product Portfolio with New 12MP-resolution Image Sensor
OMNIVISION today debuted its OX12A10 12-megapixel (MP)-resolution CMOS image sensor with TheiaCel technology at AutoSens Europe 2024.
RTX to Develop Ultra-Wide Bandgap Semiconductors for DARPA
New class of materials offer improved conductivity and thermal management properties.
Rapidus Establishes Back-End Semiconductor Manufacturing Process Research-and-Development Center
Rapidus Corporation, a company involved in the research, development, design, manufacture and sales of advanced logic semiconductors, today announced that it will set up a clean room within Seiko Epson Corporation’s facility in Chitose, Hokkaido, and open a research-and-development (R&D) center for semiconductor post-processing called Rapidus Chiplet Solutions (RCS).
Jabil Acquires Mikros Technologies
Jabil Inc. today announced the successful acquisition of Mikros Technologies LLC, a leader in the engineering and manufacturing of liquid cooling solutions for thermal management, completed October 1.
Empower Debuts Revolutionary AI Power Delivery Platform to Solve Critical Technology Roadblock
Empower Semiconductor today unveiled the Crescendo vertical power delivery platform to address the growing power demands of artificial intelligence (AI) and high-performance computing (HPC) applications.
Georgia Tech to Use ClassOne Technology Solstice S8 Single-Wafer Wet Processing System for Advanced Packaging R&D
ClassOne to support establishment of 3D heterogeneous integration hub at Georgia Tech’s Institute for Matter and Systems
Sivers Semiconductors Receives CHIPS Act Funding Award from NEMC Hub
$6M award accelerates lab-to-fab development of critical chip technology.
