First of-its-kind center will offer advanced packaging and test capabilities in New York for U.S.-made essential chips used in AI, automotive, aerospace and defense, and other applications.
Packaging
Department of Commerce Announces Preliminary Terms with Analog Devices, Coherent Corp., Intelligent Epitaxy Technology, Inc. and Sumika Semiconductor Materials Texas Inc.
Proposed CHIPS investments in Massachusetts, Oregon, Washington, Pennsylvania, and Texas, would advance key semiconductor technologies capabilities to support U.S. economic and national security.
Alchip Opens 3DIC ASIC Design Services
Alchip Technologies, Limited, the high-performance ASIC leader, has formally opened its three-dimensional integrated circuit (3DIC) design services for the latest high-performance ASICs targeting AI and high-performance computing (HPC) applications.
U.S. Department of Commerce Announces $1.4 Billion in Final Awards to Support the Next Generation of U.S. Semiconductor Advanced Packaging
Today, the U.S. Department of Commerce has announced that CHIPS National Advanced Packaging Manufacturing Program (NAPMP) has finalized $1.4 billion in award funding to bolster U.S. leadership in advanced packaging and enable new technologies to be validated and transitioned at scale to U.S. manufacturing.
Non-Profit Alliances Boost Chips in Canada
Government aid is forthcoming, but new immigration rules restrict talent.
onsemi Completes Acquisition of Qorvo’s Silicon Carbide JFET Technology Portfolio
onsemi today announced that it has completed its acquisition of the Silicon Carbide Junction Field-Effect Transistor (SiC JFET) technology business, including the United Silicon Carbide subsidiary, from Qorvo for $115 million in cash.
Vertical Compute Raises €20 Million to Revolutionize the Future of AI Computing
VerticalCompute, founded by CEO Sylvain Dubois (ex-Google) and CTO Sebastien Couet (ex-imec), today announced that it successfully closed a seed investment round of €20 million.
Lam Research Establishes 28nm Pitch in High-Resolution Patterning Through Dry Photoresist Technology
Lam Research Corporation today announced that its innovative dry photoresist (dry resist) technology has been qualified for direct-print 28nm pitch back end of line (BEOL) logic at 2nm and below by imec, a research and innovation hub in nanoelectronics and digital technologies.
Powering the Future: SEOULTECH’s Breakthrough in Vibration Energy Harvesting
Researchers propose a novel design for electromagnetic induction type vibration energy harvesters, boosting efficiency and power output.
U.S. Department of Commerce Announces Preliminary Terms with MACOM
Today, the U.S. Department of Commerce signed a non-binding preliminary memorandum of terms (PMT) with MACOM Technology Solutions Inc. to provide up to $70 million in proposed direct funding under the CHIPS and Science Act.
