With Taiwan forecast to rank as a top buyer of chipmaking equipment, the stage is set for SEMICON Taiwan 2022 as companies from across the electronics design and manufacturing supply chain gather for insights into the latest trends, developments and innovations driving industry growth.
Packaging
Micron Ships World’s First 232-Layer NAND, Extends Technology Leadership
Micron Technology, Inc. today announced that it has begun volume production of the world’s first 232-layer NAND, built with industry-leading innovations to drive unprecedented performance for storage solutions.
Intel and MediaTek Form Foundry Partnership
MediaTek will use Intel Foundry Services to manufacture new chips for a range of smart edge devices.
Using AI to Train Teams of Robots to Work Together
University of Illinois Urbana-Champaign researchers developed a method to train multiple agents such as robots or drones to work together using multi-agent reinforcement learning, a type of artificial intelligence.
IEEE International Electron Devices Meeting Announces Program Highlights for 2022
The 68th annual IEEE International Electron Devices Meeting, the world’s leading forum for the unveiling of breakthroughs in transistors and related micro/nano technologies, will be held December 3-7, 2022 in San Francisco.
Apple’s M1 Ultra Does Use InFO_LSI – or is it CoWoS-L?
On March 8, Apple held their “Peek Performance” event, introducing the all-new Mac Studio including within it the M1 Ultra processor and its unique (up to now) packaging.
Magnetic Memory Milestone
Developments in the field of spintronics promise faster, more efficient devices.
NXP Collaborates with Foxconn on Next Generation Vehicle Platforms
NXP Semiconductors today announced that it has signed a memorandum of understanding with Hon Hai Technology Group to jointly develop platforms for a new generation of smart connected vehicles.
SEMI Applauds Senate Progress on CHIPS Act of 2022, Urges Timely Congressional Approval
SEMI today applauded progress in the United States Senate on a robust package of federal incentives for the semiconductor supply chain and urged its timely passage in Congress.
Palomar Technologies Expands Innovation Center-Singapore to Support Growing Demand for Specialty OSAT/Process Development
Palomar Technologies announced today the expansion of its Innovation Center in Singapore to meet a growing demand in Southeast Asia for process development and specialty OSAT for advance semiconductor new product introductions.
