The move to electric vehicles (EVs), combined with new legislation focused on renewable energies, has led to a greatly increased demand for power electronics based on silicon carbide (SiC).
Packaging
SEMI Standards’ Leaders Honored at SEMICON West 2022
SEMI, the global industry association that unites the entire electronics manufacturing and design supply chain, announced it honored industry leaders for their outstanding accomplishments in developing Standards for the electronics and related industries.
Onto Innovation Wins 2022 Best of West Award for Atlas V Optical Critical Dimension Metrology Tool
The Atlas V optical critical dimension metrology tool from Onto Innovation, Inc. has won the 2022 Best of West award, SEMI and Semiconductor Digest announced today at SEMICON West 2022 Hybrid, July 12-14 at the Moscone Center in San Francisco.
20 Year Roadmap: Tearing Down the Walls
On Monday, in advance of SEMICON West, imec hosted its annual International Technology Forum (ITF).
Shortage to Surplus Cycle Hits Semi But One Segment Escapes
One major part of the semiconductor industry is escaping the downward trend felt by the larger market. But this time, it’s different.
ACM Research Introduces New Post-CMP Cleaning Tool for Silicon and SiC Wafer Substrate Manufacturing
ACM Research, Inc., a supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today announced the introduction of its new post-CMP cleaning tool.
SEMI Announces Election and Re-Election of Board Members
SEMI today announced at SEMICON West 2022 Hybrid the election of Tim Archer, President and CEO of Lam Research; Doris Hsu, Chairperson and CEO of GlobalWafers Co., Ltd.; and Toshiki Kawai, Representative Director and President and CEO of Tokyo Electron, as new members of the SEMI International Board.
Pfeiffer Vacuum Introduces New Multi-Stage Roots Pumps ACP 90
Pfeiffer Vacuum, a supplier of vacuum technology, introduces new multi-stage Roots pumps ACP 90, which are designed for oil- and particle free applications in the pressure range between atmosphere up to 3×10-2 hPa.
ClassOne Technology Announces New Surface Preparation Technologies that Extend the Solstice Single-Wafer Platform
ClassOne Technology, a global provider of advanced electroplating and wet processing tools for microelectronics manufacturing, today announced it has expanded its flagship Solstice automated single-wafer platform with a suite of surface preparation (SP) technologies.
EV Group Achieves Die-to-Wafer Fusion and Hybrid Bonding Milestone with 100% Die Transfer Yield on Multi-Die 3D SoC
EV Group (EVG) today announced it has achieved a major breakthrough in die-to-wafer (D2W) fusion and hybrid bonding by successfully demonstrating 100-percent void-free bonding yield of multiple die of different sizes from a complete 3D system-on-a-chip (SoC) in a single transfer process using EVG’s GEMINI FB automated hybrid bonding system.
