The CHIPS Act, microelectronics industry resilience and the future of mobility will come into focus next week at SEMICON West 2022 Hybrid, July 12-14 at the Moscone Center in San Francisco.
Packaging
Top Five MPU Suppliers Expand Share of Sales to 86% in 2021
New ranking shows long-time leader Intel sliding closer to half the total sales in microprocessors.
Photon-Controlled Diode: An Optoelectronic Device with a New Signal Processing Behavior
In a recent paper published in National Science Review, Chinese scientists report an optoelectronic device with a new signal processing behavior named photon-controlled diode.
Battery Materials Must Evolve to Keep Pace with Societal Needs
Rensselaer Professor Nikhil Koratkar and team find critical advances in nanostructures.
Samsung Begins Chip Production Using 3nm Process Technology with GAA Architecture
Optimized 3nm process achieves 45% reduced power usage, 23% improved performance, and 16% smaller surface area compared to 5nm process.
Breker Verification Systems Joins RISC-V International
Breker Verification Systems, a provider of advanced test content synthesis solutions, including RISC-V Cache Coherency and other SoC integration Verification Intellectual Property (VIP) in the “TrekApps” family, today joined RISC-V International (RVI) as a strategic member.
Imec Shows Path to Line Resistance Halving using Semi-Damascene with High-Aspect-Ratio Processing
This week, at the 2022 IEEE International Interconnect Technology Conference (IITC 2022), imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, presents options to reduce the metal line resistance at tight metal pitches, mitigating the resistance/capacitance (RC) increase of future interconnects using direct metal patterning.
Palomar Technologies places SST 5100 Vacuum Furnace at the EPIC-CENTRE-Torbay to Support Optoelectronics Packaging
Palomar Technologies announced the consignment of an SST 5100 Vacuum Reflow Furnace at the Electronics and Photonics Innovation Centre (EPIC) in Paignton, UK.
LEGO Stacking of 2D Materials Brings Us a Step Closer to Ultracompact Memory and Spintronic Technology
SUTD scientists designed a novel functional 2D hybrid material for ultracompact memory and spintronic device applications.
Weebit Nano Tapes Out ReRAM Demo Chip to SkyWater Foundry
Weebit Nano Limited, a developer of next-generation memory technologies for the global semiconductor industry, announced it has taped-out (released to manufacturing) demonstration chips integrating its embedded Resistive Random-Access Memory (ReRAM) module to SkyWater Technology’s foundry.
