The Semiconductor Industry Association (SIA) today convened a productive roundtable discussion between Sen. Mark Warner (D-Va.) — one of the senators tasked with negotiating the U.S. jobs and competitiveness package — and more than a dozen senior executives from SIA member companies.
Packaging
Top Three Suppliers Held 94% of 2021 DRAM Marketshare
Samsung, SK Hynix accounted for 71% of DRAM sales. Major supplier base now reduced to six.
Semiconductor Growth Still Seen at 11% Despite 2022 Headwinds
New quarterly update shows higher gains in microprocessors and power discretes this year, but lowers sales increases in optoelectronics while the global economy faces greater risks.
Mitsubishi Electric Expands Silicon Carbide Power Device Lineup With Industry Standard Package Dual Device
Mitsubishi Electric US, Inc. recently launched a new Silicon Carbide (SiC) power module FMF400DY-24B.
RISC-V Summit China 2022 Announces Call for Papers
The Summit will showcase the continued rapid expansion of the RISC-V ecosystem, with both commercial offerings and exciting open-source developments.
Global Embedded Die Packaging Technology Market to Generate $311.41 Million by 2030
Increase in requirement for miniaturization of electronic circuits in microelectronic devices drives the growth of the global embedded die packaging technology market.
CEA-Leti & Intel Report Die-to-Wafer Self-Assembly Breakthrough Targeting High Alignment Accuracy and Throughput
In a breakthrough for the future of die-to-wafer (D2W) bonding, CEA-Leti and Intel have optimized a hybrid direct-bonding, self-assembly process that has the potential to increase the alignment accuracy as well as fabrication throughput by several thousand dies per hour.
ClassOne Technology and Fraunhofer ENAS to Collaborate on Hybrid Bonding for Advanced Imaging Devices
Partnership will leverage firms’ respective heterogeneous-integration proficiencies to focus on development and optimization of full process-integration schemes for diverse high-density pixel array applications.
Global Semiconductor Equipment Billings Grow 5% Year-Over-Year in Q1 2022, SEMI Reports
Global semiconductor equipment billings grew 5% year-over-year to US$24.7 billion in the first quarter of 2022, SEMI announced today in its Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report.
Kioxia to Complete Acquisition of Chubu Toshiba Engineering
Kioxia Holdings Corporation announced today that it completed the acquisition of Chubu Toshiba Engineering Corporation.
