Public-private consortium will focus on innovation, collaboration, and education to bolster the U.S. semiconductor industry…
Packaging
SK hynix Begins Volume Production of the World’s First 12-Layer HBM3E
SK hynix Inc. announced today that it has begun mass production of the world’s first 12-layer HBM3E product with 36GB, the largest capacity of existing HBM to date.
SWAP Hub Project Led by Alphacore Awarded CHIPS Act Funding to Advance RF Transceiver Technology
The U.S. Department of Defense has announced that the Southwest Advanced Prototyping Hub (SWAP Hub) based at Arizona State University (ASU) has secured $5.7M in funding through the CHIPS and Science Act for an innovative project led by Alphacore Inc. to advance radio frequency (RF) transceiver technology to improve national defense and commercial capabilities.
Qamcom Collaborates with Pragmatic and Harvard on Applications in Wearables, Healthcare, and Smart Packaging
Qamcom, a knowledge-based research and technology consulting company within hardware, software and system development, announces joint research project and publication of article ‘Bendable non-silicon RISC-V microprocessor’.
Silicon Creations Awarded TSMC’s 2024 Open Innovation Platform Partner of the Year for Mixed Signal IP
Silicon Creations announced that it has been named a 2024 TSMC Open Innovation Platform (OIP) Partner of the Year for Mixed Signal IP.
Greene Tweed Welcomes Adam Phan as General Manager, Sealing Systems
Greene Tweed, a global manufacturer of high-performance sealing solutions and engineered components, announced the appointment of Adam Phan as the company’s new General Manager of Sealing Systems.
Murata Awarded 2024 Supplier of the Year – Best Quality at Qualcomm Supplier Summit
Murata announced that it was awarded with Qualcomm’s 2024 Supplier of the Year – Best Quality at the Qualcomm Supplier Summit in San Diego on August 27.
Synopsys and TSMC Pave the Path for Trillion-Transistor AI and Multi-Die Chip Design
Synopsys, Inc. today announced its continued, close collaboration with TSMC to deliver advanced EDA and IP solutions on TSMC’s most advanced process and 3DFabric technologies to accelerate innovation for AI and multi-die designs.
Samsung Electronics Develops Industry’s First Automotive SSD Based on 8th-Generation V-NAND
Samsung Electronics Co., Ltd. today announced it has successfully developed the industry’s first PCIe 4.0 automotive SSD based on eighth-generation vertical NAND (V-NAND)
New CEA-Leti Technology Improves DC-DC Converter Efficiency and Paves the Way to Piezoelectric Converters Without Transformers
Building on its earlier breakthroughs introducing a new way of converting electrical power using piezoelectric resonators and developing a dual-bridge piezoelectric resonator converter, CEA-Leti has paved the way to isolating piezoelectric converters without transformers.
