STMicroelectronics and MACOM Technology Solutions Holdings Inc. have announced the successful production of radio-frequency Gallium-Nitride-on Silicon (RF GaN-on-Si) prototypes.
Packaging
SIA Welcomes Kickoff Meeting of Conference Committee on Competition Legislation
Committee aims to reconcile differences between the Senate’s United States Innovation and Competition Act (USICA) and the House’s America COMPETES Act.
SkyWater Enters License Agreement with Xperi for Hybrid Bonding Technology
Hybrid bonding capability strongly complements SkyWater’s developing portfolio of heterogeneous integration solutions including silicon interposer and fan-out packaging.
Mitsubishi Electric Expands Silicon Carbide Power Device Lineup With Industry Standard Package Dual Device
Mitsubishi Electric US, Inc. recently launched a new Silicon Carbide (SiC) power module FMF400DY-24B
Tachyum Delivers the Highest AI and HPC Performance with the Launch of the World’s First Universal Processor
Tachyum today launched the world’s first universal processor, Prodigy, which unifies the functionality of a CPU, GPU and TPU in a single processor, creating a homogeneous architecture, while delivering massive performance improvements at a cost many times less than competing products.
STMicroelectronics Cooperates with Semikron on Silicon-Carbide Power Technology
STMicroelectronics has revealed it is supplying silicon carbide (SiC) technology for the eMPack electric-vehicle (EV) power modules from Semikron, one of the world’s leading manufacturers of power modules and systems.
Micron Announces New Greenhouse Gas Reduction Targets and Commits to Net-Zero Emissions From Its Operations by 2050
Micron Technology, Inc. today announced new targets to reduce greenhouse gas emissions as part of the company’s overall sustainability strategy outlined in its annual sustainability report.
Rhombus Energy Solutions to Leverage Wolfspeed’s Silicon Carbide Devices for Faster EV Charging Infrastructure
Rhombus Energy Solutions today announced that Wolfspeed, Inc. will supply its EV2flex line of charging infrastructure products with Silicon Carbide MOSFETs, which will offer the products greater efficiency, higher power density and faster charging times.
Semiconductor Materials at a Critical Tipping Point
TECHCET, the electronic materials advisory firm providing business and technology information, held its highly successful and well-attended 2022 Critical Materials Conference in Chandler, Arizona on April 28th and 29th.
ACM Research Receives Purchase Contract for Ultra ECP ap High-Speed Plating Systems
10 ECP ap tools purchased by top-tier Chinese OSAT to support wafer-level packaging applications.
