Henkel today announced the commercialization of its latest semiconductor-grade capillary underfill (CUF) formulation for advanced packaging applications.
Packaging
The Metaverse – From Science-Fiction to Parallel Reality
With the further development of the Metaverse, smart wearable devices such as VR headsets will have an increasing demand for high-bandwidth memory.
Brooks Instrument Introduces Korean Language Website, Building on Commitment to Local Market
Brooks Instrument has launched a Korean-language website to provide its Asia-Pacific customers with better access to resources, including in-depth product info, technical documentation, white papers, service assistance and technical support.
Aehr Receives Wafer Level Burn-in System Order from New Major Supplier of Silicon Carbide Semiconductors
Aehr Test Systems today announced it has received a purchase order from a new customer for a FOX-NP multi-wafer test and burn-in system, multiple WaferPak Contactors and a FOX WaferPak Aligner to be used for qualification of Aehr’s wafer level burn-in solution for silicon carbide devices for electric vehicles and other markets.
SEMICON Taiwan 2022 Opens Tomorrow with Spotlight on Advanced Manufacturing, Heterogeneous Integration, Sustainability and Talent
SEMICON Taiwan 2022 opens tomorrow as industry leaders and visionaries gather to discuss the latest innovations and trends driving microelectronics industry growth.
SiFive Rolls Out Powerful New RISC-V Portfolio to Address Unmet Performance and Feature Needs of Rapidly Evolving Next-Gen Digital Automobiles
SiFive, Inc. the founder and leader of RISC-V computing, today announced three products as part of the first phase of a long-term roadmap and portfolio designed to meet the specific needs of automotive manufacturers and their suppliers.
Secretaries of State, Commerce Discuss Efforts to Build a U.S Microelectronics Ecosystem
U.S. Secretary of State Antony J. Blinken and Secretary of Commerce Gina Raimondo visited Purdue University on Tuesday (Sept. 13) to tour university research facilities and meet students as they embark on their mission to bolster the U.S. semiconductor industry.
ATLANT 3D Nanosystems Secures $15M Investments to Enable Atomic Layer Advanced Manufacturing for Electronics
ATLANT 3D Nanosystems (ATLANT 3D) today announced the closure of their capital raise of $15M.
EV Group Introduces NanoCleave Layer Release Technology
IR laser cleave technology enables nanometer-precision layer transfer through silicon, eliminating glass substrates for advanced packaging and enabling thin-layer 3D stacking
Memory Market Collapse to Lift TSMC to Top Spot in 3Q22 Ranking
Plunge in memory market to drop Samsung to second place; Intel expected to fall to third.
