Bechtel today announced the formation of its new Manufacturing and Technology business.
Packaging
2021 Global Semiconductor Equipment Sales Surge 44% to Industry Record $102.6 Billion, SEMI Reports
Worldwide sales of semiconductor manufacturing equipment in 2021 surged 44% to an all-time record of $102.6 billion from $71.2 billion in 2020.
Georgia Tech to Help Define Future of Microelectronics Industry
Georgia Institute of Technology has been selected as a key collaborator in producing a roadmap for the future of advanced packaging for next generation microelectronics.
Leading Semiconductor Players to Advance Next Generation FD-SOI Roadmap for Automotive, IoT and Mobile Applications
CEA, Soitec, GlobalFoundries and STMicroelectronics have announced a new collaboration in which they intend to jointly define the industry’s next generation roadmap for FD-SOI (fully depleted silicon-on-insulator) technology.
Murata Named as an Intel 2022 EPIC Distinguished Supplier
Murata announced that it has earned Intel’s Excellence, Partnership, Inclusion and Continuous Improvement (EPIC) Distinguished Supplier Award.
First Integrated Laser on Lithium Niobate Chip
For all the recent advances in integrated lithium niobate photonic circuits — from frequency combs to frequency converters and modulators — one big component has remained frustratingly difficult to integrate: lasers.
SRC Selected by NIST’s Advanced Manufacturing Office to Define the Future of Microelectronics and Advanced Packaging Technology
Semiconductor Research Corporation (SRC) announced today that it has been selected by the U.S. Department of Commerce’s National Institute of Standards and Technology’s (NIST) Advanced Manufacturing Office to define the future technology goals of the microelectronics and advanced packaging technology (MAPT) industry.
Quantum Brilliance Establishes Research Hub with La Trobe University and RMIT University to Accelerate Development of Diamond-based Quantum Computers
Research Hub for Diamond Quantum Materials will develop new fabrication methods for quantum microprocessors to increase computational power and enable mass-manufacturing of devices.
Top Five Leaders Continue Expanding Share of Global IC Fab Capacity
At the end of 2021, 57% of the industry’s total monthly wafer capacity was owned by the top five companies.
Marki Microwave Introduces High Frequency, Ultra-Small Form Factor Chip Scale Packaging Platform
Marki Microwave today introduced a family of GaAs monolithic microwave integrated circuit (MMIC)-based equalizers and attenuators, designed using the company’s new patent pending chip scale packaging (CSP) platform.
