Veeco Instruments Inc. today announced that the Taiwan Semiconductor Research Institute, National Applied Research Laboratories has selected Veeco’s Propel R&D Metal Organic Chemical Vapor Deposition (MOCVD) System for advanced development and collaboration related to gallium nitride (GaN)-based power and RF devices.
Packaging
Global Fab Equipment Spending Expected to Reach Record $109 Billion in 2022
Fab equipment investment in 2023 is expected to remain strong.
SEMICON West 2022 Hybrid to Spotlight Sustainability, Smart Technologies, Talent
Sustainability, smart technologies and workforce development will take center stage at SEMICON West 2022 Hybrid, July 12-14 at the Moscone Center in San Francisco, as more than 200 industry leaders, visionaries and technology experts convene
Sen. Mark Warner, Semiconductor Industry Execs Meet to Discuss Strengthening Domestic Chip Research, Design, Manufacturing
The Semiconductor Industry Association (SIA) today convened a productive roundtable discussion between Sen. Mark Warner (D-Va.) — one of the senators tasked with negotiating the U.S. jobs and competitiveness package — and more than a dozen senior executives from SIA member companies.
Top Three Suppliers Held 94% of 2021 DRAM Marketshare
Samsung, SK Hynix accounted for 71% of DRAM sales. Major supplier base now reduced to six.
Semiconductor Growth Still Seen at 11% Despite 2022 Headwinds
New quarterly update shows higher gains in microprocessors and power discretes this year, but lowers sales increases in optoelectronics while the global economy faces greater risks.
Mitsubishi Electric Expands Silicon Carbide Power Device Lineup With Industry Standard Package Dual Device
Mitsubishi Electric US, Inc. recently launched a new Silicon Carbide (SiC) power module FMF400DY-24B.
RISC-V Summit China 2022 Announces Call for Papers
The Summit will showcase the continued rapid expansion of the RISC-V ecosystem, with both commercial offerings and exciting open-source developments.
Global Embedded Die Packaging Technology Market to Generate $311.41 Million by 2030
Increase in requirement for miniaturization of electronic circuits in microelectronic devices drives the growth of the global embedded die packaging technology market.
CEA-Leti & Intel Report Die-to-Wafer Self-Assembly Breakthrough Targeting High Alignment Accuracy and Throughput
In a breakthrough for the future of die-to-wafer (D2W) bonding, CEA-Leti and Intel have optimized a hybrid direct-bonding, self-assembly process that has the potential to increase the alignment accuracy as well as fabrication throughput by several thousand dies per hour.
