Market forecast of 12% growth in 2022 follows historic 30% jump in analog sales in 2021.
Packaging
Kioxia Corporation to Expand 3D Flash Memory Production Capacity by Building New Fabrication Facility at Kitakami Plant
Kioxia Corporation today announced it will begin construction of a new fabrication facility (Fab2) at its Kitakami Plant in Iwate Prefecture, Japan for the possible expansion of production of its proprietary 3D Flash memory BiCS FLASH.
Global Fab Equipment Spending Expected to Hit New High of $107 Billion in 2022, SEMI Reports
Industry drive to expand and upgrade capacity to push spending over $100 billion for first time.
Microchip Unveils Industry-Leading 3.3 kV Silicon Carbide (SiC) Power Devices Enabling New Levels of Efficiency and Reliability
System designers of traction power units (TPUs), auxiliary power units (APUs), solid-state transformers (SSTs), industrial motor drives and energy infrastructure solutions require high-voltage switching technology to increase efficiency, reduce system size and weight and enhance reliability.
SIA Endorses FABS Act Introduced in House
The Semiconductor Industry Association (SIA) today applauded introduction in the House of Representatives of the Facilitating American-Built Semiconductors (FABS) Act, bipartisan legislation that would establish an investment tax credit to incentivize semiconductor manufacturing, design, and research in the United States.
Multinational Semiconductor Company Orders Multiple Veeco Wet Processing Systems for Advanced Packaging Applications
Veeco Instruments Inc. today announced that a semiconductor manufacturer has ordered multiple Veeco WaferStorm Wet Processing Systems for advanced packaging applications.
Scientists Have Improved Polymer Films for Organic Electronics
Researchers improved polymer films, the basis for organic electric. The new material is promising for increasing the capacity in lithium polymer batteries, solar cells, and modernization of organic field-effect transistors.
Making Memory Serve Correctly: Fixing an Inherent Problem in Next-Generation Magnetic RAM
Scientists propose method to eliminate a disturbance source in spin-orbit torque RAM, a type of memory that could enable ultra-low-power electronics.
Intel Announces Initial Investment of More Than €33 Billion for Semiconductor R&D and Manufacturing in EU
Investments advance world-class semiconductor ecosystem in Europe, spanning France, Germany, Ireland, Italy, Poland and Spain.
SiFive Leadership in RISC-V Powers $2.5B+ Company Valuation
SiFive, Inc. today announced it has raised $175 million in a Series F financing round, valuing the company at over $2.5 billion.
