Thirty-year software, engineering, and semiconductor industry veteran brings deep technical knowledge and C-level executive management experience to Dirac.
Packaging
Nordson Electronics Solutions to Feature High-Throughput Fluid Dispensing Technologies at SEMICON Taiwan 2024
Nordson Electronics Solutions will feature the latest technologies in fluid dispensing for semiconductor advanced packaging at the SEMICON Taiwan tradeshow, booth L0516.
Lita Shon-Roy, President/CEO of TECHCET Wins Gold Stevie Award in 2024 International Business Awards
Lita Shon-Roy, President and CEO of TECHCET, was named the winner of a Gold Stevie Award in the Thought Leader of The Year – Business Services category in The 21st Annual International Business Awards for her work as a Semiconductor Materials Supply Chain Thought Leader.
EV Group Highlights 3D Integration Process Solutions at SEMICON Taiwan 2024
EV Group (EVG) today announced that it will highlight key advances in hybrid and fusion wafer bonding, infrared (IR) laser layer release technology, and lithography for advanced semiconductor and micro-electronics manufacturing and packaging at the SEMICON Taiwan 2024 expo in Taipei, Taiwan on September 4-6.
New IBM Processor Innovations to Accelerate AI on Next-Generation IBM Z Mainframe Systems
IBM revealed architecture details for the upcoming IBM Telum II Processor and IBM Spyre Accelerator at Hot Chips 2024.
Everspin Awarded $14.55M to Provide Continued, Stable On-Shore MRAM Manufacturing
Under the award, Everspin will provide a plan to mitigate risks to its MRAM manufacturing supply chain.
Oxford Instruments Asylum Research Receives R&D 100 and Frost & Sullivan Awards for its Vero Atomic Force Microscope
Oxford Instruments Asylum Research announced today that its next-generation Atomic Force Microscope (AFM), Vero, has received three prestigious awards.
NSF Awards $38M to Strengthen Research Infrastructure
The U.S. National Science Foundation has awarded researchers in Maine, Mississippi, New Mexico, Puerto Rico and Rhode Island roughly $38 million through the Established Program to Stimulate Competitive Research (EPSCoR), which promotes the development of research competitiveness among 28 targeted states and territories, called jurisdictions.
Semiconductor Industry Experts to Present Solutions to Boost Performance at Advanced Packaging Summit in Korea
The Advanced Packaging Summit 2024 will gather industry visionaries on September 11 at the Suwon Convention Center to present packaging technology roadmaps and discuss solutions to performance challenges.
Fujitsu Semiconductor Memory Solution Announces Change in Its Name to RAMXEED LIMITED
Fujitsu Semiconductor Memory Solution Limited is pleased to announce that the company name will change to RAMXEED LIMITED, effective January 1, 2025.
