With advanced materials a critical enabler of semiconductor growth applications, Strategic Materials Conference (SMC 2022) will gather top executives and leaders from every segment of semiconductor manufacturing for insights into the latest developments in advanced materials October 3-5, 2022 at the DoubleTree by Hilton in San Jose, Calif.
Packaging
3M and Nordson Introduce a New Automated Bonding System
This end-to-end bonding solution combines all the benefits of 3M VHB Tapes with the versatility of a liquid adhesive in a single contained footprint enabling usage on any scale.
JCET Begins Construction of a New High-End Manufacturing Base in Jiangyin
The “JCET Microelectronics Wafer-level Microsystems Integration High-end Manufacturing Project,” officially started construction of JCET’s new plant in Jiangyin City of Jiangsu province.
Industry Reacts to Passage of CHIPS and Science Act of 2022
Semiconductor companies around the globe issued statements on Thursday following the passage of legislation of the CHIPS and Science Act of 2022 in the U.S. House of Representatives aimed at increasing American semiconductor manufacturing.
Flexible Hybrid Capacitors Based on Transition Metal Composite Electrode
The shortage of fossil energy sources lead to high requirements for the exploration of sustainable energy conversion and storage equipment. Supercapacitor (SC) is a kind of excellent energy storage device due to the high power density and long cycle life. However, the low energy density restricts their further practical application. Therefore, it is extremely important to develop high-performance electrode materials with excellent performances.
NEO Semiconductor Launches Second-Generation X-NAND Flash Memory Architecture
NEO Semiconductor, a developer of innovative architectures for NAND flash and DRAM memory, today announced the release of its second-generation X-NAND architecture.
Finwave Semiconductor Raises $12.2M Series A Funding Round to Advance the Ultimate Transistor for 5G
3DGaN (Gallium Nitride) innovators Finwave Semiconductor, Inc.ctor, Inc. today announced a $12.2 million Series A funding round led by Fine Structure Ventures with additional participation from Citta Capital, Soitec, Safar Partners and Alumni Ventures.
Improving Image Sensors for Machine Vision
On-chip spectrometer, silicon nanowires determine light spectrum, angle.
SEMICON Taiwan 2022 to Highlight Auto Chips, Advanced Manufacturing, Heterogeneous Integration and Sustainability
With Taiwan forecast to rank as a top buyer of chipmaking equipment, the stage is set for SEMICON Taiwan 2022 as companies from across the electronics design and manufacturing supply chain gather for insights into the latest trends, developments and innovations driving industry growth.
Micron Ships World’s First 232-Layer NAND, Extends Technology Leadership
Micron Technology, Inc. today announced that it has begun volume production of the world’s first 232-layer NAND, built with industry-leading innovations to drive unprecedented performance for storage solutions.
