Micross Components, Inc. announced an exclusive partnership with Apogee Semiconductor.
Packaging
Edwards Invests in New Arizona Facility to Support North America Semiconductor Growth
Edwards, the supplier of vacuum and abatement services and solutions to the global semiconductor industry, has announced its investment in a new manufacturing facility in Chandler.
Samsung’s LPDDR5X DRAM Validated for Use with Qualcomm Technologies’ Snapdragon Mobile Platforms
Samsung Electronics Co., Ltd. today announced that Qualcomm Technologies, Inc. has validated Samsung’s 14-nanometer (nm) based 16-gigabit (Gb) Low Power Double Data Rate 5X (LPDDR5X) DRAM for use on Qualcomm Technologies’ Snapdragon mobile platforms.
Breker Verification Systems Unleashes the SystemUVM Initiative to Empower UVM Engineering
Breker Verification Systems used the opening of DVCon U.S. today to unveil SystemUVM, a framework designed to simplify specification model composition for test content synthesis with a UVM/SystemVerilog syntactic and semantic approach familiar to universal verification methodology (UVM) engineers.
Renesas and Fixstars to Establish Automotive SW Platform Lab to Develop Software and Operating Environments for Deep Learning
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, and Fixstars Corporation, a developer of multi-core CPU/GPU/FPGA acceleration technology, announced their intention to collaborate in the automotive deep learning field.
Leaders in Semiconductors, Packaging, IP Suppliers, Foundries, and Cloud Service Providers Join Forces to Standardize Chiplet Ecosystem
Advanced Semiconductor Engineering, Inc. (ASE), AMD, Arm, Google Cloud, Intel Corporation, Meta, Microsoft Corporation, Qualcomm Incorporated, Samsung, and Taiwan Semiconductor Manufacturing Company today announced the formation of an industry consortium that will establish a die-to-die interconnect standard and foster an open chiplet ecosystem.
Silvaco Announces that Teledyne e2v Expands Adoption of its Victory TCAD Solution to Further Accelerate Development of CMOS Image Sensors
Silvaco Group, Inc., a provider of TCAD, EDA software, and Design IP, today announced that Teledyne e2v, a global leader in imaging solutions, has renewed its commitment to Silvaco’s Victory TCAD solution to accelerate its CMOS image sensor development.
EV Group and Teramount Announce Collaboration to Implement Innovative Packaging Technologies for Photonic Integrated Circuits
The collaboration will leverage EVG’s nanoimprint lithography (NIL) technology, expertise and services with Teramount’s PhotonicPlug technology.
Micron Delivers World’s Most Advanced 176-Layer NAND Data Center SSD
Micron Technology, Inc., today announced it is sampling the world’s first vertically-integrated 176-layer NAND solid-state drive (SSD) for the data center.
CEVA Announces Milestone of 100 Million CEVA-powered Cellular IoT Chips Shipped
CEVA, Inc., the licensor of wireless connectivity and smart sensing technologies and integrated IP solutions, today announced that more than 100 million CEVA-powered cellular IoT chips have been shipped by CEVA licensees since the beginning of 2020.
