MediaTek will use Intel Foundry Services to manufacture new chips for a range of smart edge devices.
Packaging
Using AI to Train Teams of Robots to Work Together
University of Illinois Urbana-Champaign researchers developed a method to train multiple agents such as robots or drones to work together using multi-agent reinforcement learning, a type of artificial intelligence.
IEEE International Electron Devices Meeting Announces Program Highlights for 2022
The 68th annual IEEE International Electron Devices Meeting, the world’s leading forum for the unveiling of breakthroughs in transistors and related micro/nano technologies, will be held December 3-7, 2022 in San Francisco.
Apple’s M1 Ultra Does Use InFO_LSI – or is it CoWoS-L?
On March 8, Apple held their “Peek Performance” event, introducing the all-new Mac Studio including within it the M1 Ultra processor and its unique (up to now) packaging.
Magnetic Memory Milestone
Developments in the field of spintronics promise faster, more efficient devices.
NXP Collaborates with Foxconn on Next Generation Vehicle Platforms
NXP Semiconductors today announced that it has signed a memorandum of understanding with Hon Hai Technology Group to jointly develop platforms for a new generation of smart connected vehicles.
SEMI Applauds Senate Progress on CHIPS Act of 2022, Urges Timely Congressional Approval
SEMI today applauded progress in the United States Senate on a robust package of federal incentives for the semiconductor supply chain and urged its timely passage in Congress.
Palomar Technologies Expands Innovation Center-Singapore to Support Growing Demand for Specialty OSAT/Process Development
Palomar Technologies announced today the expansion of its Innovation Center in Singapore to meet a growing demand in Southeast Asia for process development and specialty OSAT for advance semiconductor new product introductions.
Rambus Expands Portfolio of DDR5 Memory Interface Chips for Data Centers and PCs
Rambus Inc. today announced the expansion of its DDR5 memory interface chip portfolio with the addition of the Rambus SPD (Serial Presence Detect) Hub and Temperature Sensor.
Emerging Metrology Requirements for Heterogeneous Integration and 3D Packaging
The ability to speed up the deployment of heterogeneous integration in mass production requires new and more frequent types of measurements in key manufacturing processes, including wafer and die bonding as well as lithography.
