SEMI and TechSearch International today announced a new edition of the Worldwide Assembly & Test Facility Database offering significantly expanded coverage that now includes integrated device manufacturer (IDM) facilities.
Packaging
Imec, KU Leuven and PragmatIC Semiconductor Demonstrate Fastest 8-bit Flexible Microprocessor for Low-Power Applications
This week, at the 2022 International Solid-State Circuits Conference (2022 ISSCC), imec, a research and innovation hub in nanoelectronics and digital technologies, KU Leuven, and PragmatIC Semiconductor, a developer of flexible electronics, present the fastest 8-bit microprocessor in 0.8µm metal-oxide flexible technology capable of running real-time complex assembly code.
Metal Mix and Match: An Unexpected Discovery Could Improve the Crystallinity of Coordination Nanosheets
Scientists develop a simple strategy to enhance the structural properties of coordination nanosheets by mixing two metal ion solutions together, using a powerful organic ligand.
Intel Names Christoph Schell Executive Vice President and Chief Commercial Officer
Schell joins Intel to help drive customer and partner success and capitalize on the largest opportunity in the company’s history.
LET-a CeMAT ASIA Event 2022
LET-a CeMAT ASIA event is the biggest intelligent logistics equipment and technology trade fair in South China.
Advanced Packaging Market Worth $55B, Globally, by 2028 at 8% CAGR
The advanced packaging market to grow at a CAGR of 8% to reach $55 billion by 2028 from ~$30 billion in 2020.
ACM Research Receives Orders for Ultra ECP map and Ultra ECP ap Copper Plating Systems
ACM Research, Inc., a supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today announced purchase orders for 13 Ultra ECP map and 8 Ultra ECP ap copper plating systems, of which 10 tools are repeat orders from a top-tier Chinese foundry.
AdvaMed, Semiconductor Industry Association Convene Roundtable on Supply Chain Issues
Last week, AdvaMed President and CEO Scott Whitaker and Semiconductor Industry Association (SIA) President and CEO John Neuffer hosted a joint roundtable discussion that included dozens of industry leaders and supply chain executives from SIA and AdvaMed member companies, as well as senior officials from the Department of Commerce.
Keysight, Samsung Sign Memorandum of Understanding to Advance Research and Development of 6G Technology
Keysight Technologies, Inc. announced that the company has signed a memorandum of understanding (MoU) with Samsung Research to advance research and development of 6G technology, the next generation of wireless communication.
Lawrence Berkeley National Laboratory Unveils ASIC Chip Failure Bypass System
Lawrence Berkeley National Laboratory (Berkeley Lab) scientists have developed a technique to automatically bypass failed Application Specific Integrated Circuits (ASICs) deployed in large arrays by rerouting dynamically around them.
